Hanmi Semiconductor

The company will hold one-on-one and group meetings with major overseas institutional investors on June 23, 2026 in Seoul as part of the 2026 CITIC CLSA Northeast Asia Forum, sponsored by CLSA Securities. Key talking points include entry into the AI system semiconductor market (foundry, OSAT) via the launch of 2.5D Package TC Bonders (40/120), supply of new HBF (High Bandwidth Flash) TC Bonders to customers in response to expanding AI memory demand, and expansion into the US semiconductor market including TeraFab to address AI and aerospace packaging equipment demand. The agenda signals continued diversification of the TC Bonder product portfolio beyond HBM into adjacent high-growth packaging niches. The schedule is subject to change.

The company resolved to acquire shares of SpaceX (USA, CEO Elon Musk) for KRW 50 billion, equivalent to 7.24% of equity capital and 6.15% of total assets. The investment targets Elon Musk's Terafab vision and SpaceX's growth in AI, satellite communications, aerospace, and advanced semiconductor demand. The acquisition will be executed via on-market purchase in USD, with completion scheduled for 2026-06-16; final share count and stake ratio will be re-disclosed after settlement. SpaceX's latest financials (per SEC Form S-1) show KRW 28.5T in revenue but a KRW 7.5T net loss for the year.

The company secured a KRW 44.2 billion order from SK Hynix for its 'TC BONDER 4.5 GRIFFIN' equipment used in HBM4 manufacturing. The contract size represents 7.66% of 2025 consolidated revenue, a meaningful single-order win. Delivery is scheduled between June 8, 2026 and September 2, 2026, though the end date may shift based on customer coordination. No down payment is involved, and the amount excludes VAT. This reinforces the company's position as a key TC bonder supplier for SK Hynix's HBM4 ramp.

The company will participate in the '2026 Korea Conference' on June 16-17, 2026, hosted by Merrill Lynch, holding one-on-one and group meetings with major domestic and international institutional investors in Seoul. Management plans to highlight expansion into new markets, including the AI system semiconductor space (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40/120) and the High Bandwidth Flash (HBF) market with a new-concept TC Bonder addressing growing AI memory demand. The company also emphasized its participation in the US-led AI semiconductor alliance, positioning itself to supply AI packaging equipment to big tech, memory, and foundry players. This IR signals an aggressive push beyond its core HBM TC bonder franchise into broader AI packaging opportunities.

The company will participate in the '2026 Asia Conference in New York' from June 8-10, 2026, hosted by Merrill Lynch, holding one-on-one and group meetings with major overseas institutional investors. Management plans to highlight entry into new markets, including the AI system semiconductor space (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40·120) and the HBF (High Bandwidth Flash) market with a new-concept TC Bonder addressing expanding AI memory demand. The company also emphasized its participation in the U.S.-led AI semiconductor alliance, positioning itself to supply AI packaging equipment to big tech, memory, and foundry players. This NDR provides a venue to pitch the company's expansion beyond HBM into broader AI packaging equipment opportunities.

The company filed its annual corporate governance report for FY2025, disclosing a 40% compliance rate with the 15 core governance indicators set by the Korea Exchange. Compared with the prior period, the company newly adopted electronic voting, avoided concentrated AGM dates, and began holding quarterly meetings between the internal audit body and external auditors without management present. However, key gaps remain: no 4-week advance AGM notice, no formal CEO succession plan, no internal control/risk management policy, no independent audit support organization, no board gender diversity, and the board chair is not an independent director. The board consists of just 2 inside directors and 1 outside director, and the largest shareholder (Kwak Dong-shin) holds 55.75% with minority shareholders at 38.43%. Consolidated FY2025 revenue rose to KRW 576.7 bn (vs. KRW 558.9 bn prior), though operating profit slipped slightly to KRW 251.4 bn; net income recovered to KRW 214.0 bn.

The company will hold an IR briefing on June 4, 2026 in Seoul for major domestic institutional investors, sponsored by LS Securities. The session will cover the H2 2026 outlook and expansion into new overseas markets, including entry into the AI system semiconductor (foundry, OSAT) market with new 2.5D Package TC Bonders (40/120), launch of a new-concept TC Bonder for the HBF (High Bandwidth Flash) market, and participation in the US-led AI semiconductor alliance covering Big Tech, memory, and foundry players. The briefing signals a strategic pivot beyond HBM into broader AI packaging equipment demand. Schedule is subject to change.

Chairman and controlling shareholder Kwak Dong Shin has filed a mandatory trading plan disclosing his intent to purchase 25,240 common shares on June 18, 2026, at ₩317,000 per share (based on the prior day's KRX closing price), for a total of approximately ₩8.0 billion. The stated purpose is to enhance corporate value through direct personal acquisition of company shares. This planned purchase follows three open-market buys over the preceding six months totaling 98,394 shares for approximately ₩14.2 billion, indicating a sustained pattern of insider accumulation. Upon execution, the chairman's stake will increase marginally from 33.57% to 33.60% of total issued shares. Under Korean securities law, the actual transaction size may vary within 70–130% of the disclosed transaction amount.

The company will participate in the Macquarie Asia Conference 2026 in Hong Kong from May 18-20, holding one-on-one and group meetings with major overseas institutional investors. Management plans to present three new market entries: 2.5D Package TC Bonders (40/120) for the AI system semiconductor foundry/OSAT market, a new-concept TC Bonder for the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in the US-led AI semiconductor alliance with Big Tech, memory, and foundry players. The event is sponsored by Macquarie Securities and aims to position the company as a key supplier of AI packaging equipment. This is a proactive overseas IR targeting foreign institutional capital, with concrete product roadmap disclosures that go beyond typical conference attendance.

Hanmi Semiconductor filed its Q1 2026 quarterly report covering January 1 to March 31, 2026, the first quarter of its 47th fiscal year. The company maintains three unlisted consolidated subsidiaries with no changes during the period. A NICE D&B credit rating renewal on April 21, 2026 assigned an AA0 grade (valid through April 20, 2027), indicating strong commercial creditworthiness and resilience to environmental changes. The filing is a routine regulatory disclosure with the detailed business performance, financial statements, and management discussion contained in subsequent sections not fully shown here. CEO Kwak Dong-shin signed the filing, with Vice President Kim Jung-young as the responsible preparer.

Preliminary Q1 2026 consolidated results show a sharp downturn, with revenue falling 38.7% QoQ and 65.5% YoY to KRW 50.9 billion. Operating profit collapsed 87.9% YoY to KRW 8.5 billion, while net income fell 65.2% YoY to KRW 19.0 billion. The pre-tax profit of KRW 25.1 billion held up better than operating profit, suggesting non-operating gains cushioned the bottom line. The steep declines reflect a meaningful slowdown in HBM-related TC bonder demand following the prior year's exceptional peak, and warrant close attention from investors.

Hanmi Semiconductor will host a group conference call on May 12, 2026, hosted by CLSA, targeting major European institutional investors to outline the company's business status and strategic direction. Management plans to highlight three new market entries: system semiconductor packaging (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40 and 120 models), a new TC Bonder concept addressing the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in a US-led AI semiconductor alliance to capture demand for AI packaging equipment. The disclosure signals a deliberate diversification beyond Hanmi's core HBM TC bonder franchise into adjacent high-growth AI-driven segments. The IR is informational rather than transactional, but the explicit roadmap into HBF and US AI alliances may shape investor expectations on the company's TAM expansion.