IR Briefing at 2026 CITIC CLSA Northeast Asia Forum — Hanmi Semiconductor

Summary

The company will hold one-on-one and group meetings with major overseas institutional investors on June 23, 2026 in Seoul as part of the 2026 CITIC CLSA Northeast Asia Forum, sponsored by CLSA Securities. Key talking points include entry into the AI system semiconductor market (foundry, OSAT) via the launch of 2.5D Package TC Bonders (40/120), supply of new HBF (High Bandwidth Flash) TC Bonders to customers in response to expanding AI memory demand, and expansion into the US semiconductor market including TeraFab to address AI and aerospace packaging equipment demand. The agenda signals continued diversification of the TC Bonder product portfolio beyond HBM into adjacent high-growth packaging niches. The schedule is subject to change.

Filed	P₀	P₊₅	+5d
Jun 5, 2026	₩283,000	₩327,500	+15.72%
Jun 5, 2026	₩283,000	₩327,500

Filed

P₀

P₊₅

+5d

Jun 5, 2026

₩283,000

₩327,500

+15.72%

Jun 5, 2026

₩283,000

₩327,500

Full Translation

Notice of IR (Investor Relations) Briefing 1. Date and Location - Date: 2026-06-23 (time unspecified) - Location: Seoul 2. Target Participants - Major overseas institutional investors 3. Purpose - Participation in the '2026 CITIC CLSA Northeast Asia Forum' 4. Format - One-on-One and group meetings 5. Sponsor - CLSA Securities 6. Key Briefing Content (Summary) 1) Entry into the AI system semiconductor market (foundry, OSAT) - Launch of 2.5D Package TC Bonders (40 / 120) 2) Supply of HBF (High Bandwidth Flash) TC Bonders to customers - Launch of a new-concept TC Bonder in response to expanding AI memory semiconductor demand 3) Expansion into the US semiconductor market, including TeraFab - Addressing demand for AI and aerospace packaging equipment 7. Decision Date: 2026-06-22 8. IR Materials - Posting date: - - Related webpage: - 9. Other Material Matters Related to Investment Judgment - This IR schedule may be changed due to company circumstances. * Related disclosures: -