IR Event: 2026 Asia Conference in New York (Jun 8-10) — Hanmi Semiconductor

Summary

The company will participate in the '2026 Asia Conference in New York' from June 8-10, 2026, hosted by Merrill Lynch, holding one-on-one and group meetings with major overseas institutional investors. Management plans to highlight entry into new markets, including the AI system semiconductor space (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40·120) and the HBF (High Bandwidth Flash) market with a new-concept TC Bonder addressing expanding AI memory demand. The company also emphasized its participation in the U.S.-led AI semiconductor alliance, positioning itself to supply AI packaging equipment to big tech, memory, and foundry players. This NDR provides a venue to pitch the company's expansion beyond HBM into broader AI packaging equipment opportunities.

Filed	P₀	P₊₅	+5d
Jun 22, 2026	₩301,500	₩256,000	-15.09%
Jun 5, 2026	₩283,000	₩327,500	+15.72%

Filed

P₀

P₊₅

+5d

Jun 22, 2026

₩301,500

₩256,000

-15.09%

Jun 5, 2026

₩283,000

₩327,500

+15.72%

Full Translation

Notice of IR (Investor Relations) Event 1. Date and Location - Date: 2026-06-08 (time TBD) - Location: New York, USA 2. Target Participants - Major overseas institutional investors 3. Purpose - Participation in the '2026 Asia Conference in New York' 4. Format - One-on-One and group meetings 5. Sponsoring Institution - Merrill Lynch Securities 6. Key Presentation Content (Summary) ● Hanmi Semiconductor's Entry into New Markets 1. AI System Semiconductor (Foundry, OSAT) Market : Launch of 2.5D Package TC Bonder (40·120) 2. HBF (High Bandwidth Flash) Market : Launch of new-concept TC Bonder in response to expanding AI semiconductor memory demand 3. Participation in the U.S.-led AI Semiconductor Alliance : Responding to AI package equipment demand from Big Tech, memory, and foundry players 7. Decision Date: 2026-06-05 8. IR Materials - Posting date/time: - - Related webpage: - 9. Other Important Matters for Investment Judgment 1. This IR schedule may change depending on the company's circumstances. 2. Key Schedule - 6/8 ~ 6/10: Participation in 2026 Asia Conference in New York ※ Related Disclosures: -