HBM4 TC Bonder 4.5 Griffin Order Worth KRW 44.2B from SK Hynix — Hanmi Semiconductor

Summary

The company secured a KRW 44.2 billion order from SK Hynix for its 'TC BONDER 4.5 GRIFFIN' equipment used in HBM4 manufacturing. The contract size represents 7.66% of 2025 consolidated revenue, a meaningful single-order win. Delivery is scheduled between June 8, 2026 and September 2, 2026, though the end date may shift based on customer coordination. No down payment is involved, and the amount excludes VAT. This reinforces the company's position as a key TC bonder supplier for SK Hynix's HBM4 ramp.

Filed	P₀	P₊₅	+5d
Jan 14, 2026	₩177,800	₩172,200	-3.15%
Nov 17, 2025	₩132,300	₩119,600	-9.60%

Filed

P₀

P₊₅

+5d

Jan 14, 2026

₩177,800

₩172,200

-3.15%

Nov 17, 2025

₩132,300

₩119,600

-9.60%

Full Translation

Single Sales/Supply Contract 1. Type of Sales/Supply Contract: Other Sales/Supply Contract - Contract Name: Order for 'TC BONDER 4.5 GRIFFIN' equipment for HBM4 manufacturing 2. Contract Details - Contract Amount (KRW): 44,200,000,000 - Most Recent Revenue (KRW): 576,684,619,527 - Ratio to Revenue (%): 7.66 - Large Corporation Status: Not applicable 3. Counterparty: SK Hynix Inc. - Relationship with Company: - 4. Sales/Supply Region: South Korea 5. Contract Period - Start Date: 2026-06-08 - End Date: 2026-09-02 6. Key Contract Terms - Down Payment/Advance Payment: None - Payment Terms: - 7. Contract (Order) Date: 2026-06-08 8. Disclosure Deferral - Reason for Deferral: - - Deferral Deadline: - 9. Other Material Matters Related to Investment Decisions 1) The above contract amount is exclusive of VAT. 2) The above is an order for 'TC BONDER 4.5 GRIFFIN' equipment used in HBM4 manufacturing. 3) The most recent revenue figure is the 2025 consolidated revenue. 4) The contract (order) date is the date the Purchase Order (P/O) was received. 5) The end date of the contract period in item 5 (delivery date) may change based on consultation with the customer. ※ Related Disclosures: -