IR Briefing on H2 2026 Outlook and New Market Entry — Hanmi Semiconductor

Summary

The company will hold an IR briefing on June 4, 2026 in Seoul for major domestic institutional investors, sponsored by LS Securities. The session will cover the H2 2026 outlook and expansion into new overseas markets, including entry into the AI system semiconductor (foundry, OSAT) market with new 2.5D Package TC Bonders (40/120), launch of a new-concept TC Bonder for the HBF (High Bandwidth Flash) market, and participation in the US-led AI semiconductor alliance covering Big Tech, memory, and foundry players. The briefing signals a strategic pivot beyond HBM into broader AI packaging equipment demand. Schedule is subject to change.

Filed	P₀	P₊₅	+5d
Jun 22, 2026	₩301,500	₩256,000	-15.09%
Jun 5, 2026	₩283,000	₩327,500

Filed

P₀

P₊₅

+5d

Jun 22, 2026

₩301,500

₩256,000

-15.09%

Jun 5, 2026

₩283,000

₩327,500

Full Translation

Hanmi Semiconductor / IR Briefing Announcement / (2026.06.01) IR Briefing Announcement 1. Date and Location - Date: 2026-06-04, time TBD - Location: Seoul 2. Participants - Major domestic institutional investors 3. Purpose - H2 2026 outlook and overseas new market entry 4. Format - Group meeting 5. Sponsor - LS Securities 6. Key Briefing Contents (Summary) ● Hanmi Semiconductor, Entry into New Markets 1. AI System Semiconductor (Foundry, OSAT) Market - Launch of 2.5D Package TC Bonders (40, 120) 2. HBF (High Bandwidth Flash) Market - Launch of new-concept TC Bonder in response to expanding AI semiconductor memory demand 3. Participation in the US-led AI semiconductor alliance - Responding to AI packaging equipment demand across Big Tech, memory, and foundry players 7. Decision Date: 2026-06-01 8. IR Materials - Posting date: - - Related webpage: - 9. Other Material Information for Investment Decisions - The schedule of this IR briefing may change depending on company circumstances. ※ Related disclosures: -