IR Conference Call with European Institutional Investors via CLSA — Hanmi Semiconductor

Summary

Hanmi Semiconductor will host a group conference call on May 12, 2026, hosted by CLSA, targeting major European institutional investors to outline the company's business status and strategic direction. Management plans to highlight three new market entries: system semiconductor packaging (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40 and 120 models), a new TC Bonder concept addressing the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in a US-led AI semiconductor alliance to capture demand for AI packaging equipment. The disclosure signals a deliberate diversification beyond Hanmi's core HBM TC bonder franchise into adjacent high-growth AI-driven segments. The IR is informational rather than transactional, but the explicit roadmap into HBF and US AI alliances may shape investor expectations on the company's TAM expansion.

Filed	P₀	P₊₅	+5d
Jun 22, 2026	₩301,500	₩256,000	-15.09%
Jun 5, 2026	₩283,000	₩327,500

Filed

P₀

P₊₅

+5d

Jun 22, 2026

₩301,500

₩256,000

-15.09%

Jun 5, 2026

₩283,000

₩327,500

Full Translation

Hanmi Semiconductor / Notice of Investor Relations (IR) Event (Informational Disclosure) / (2026.05.11) Notice of Investor Relations (IR) Event (Informational Disclosure) 1. Date and Location - Date: 2026-05-12, time unspecified - Location: CLSA Securities office 2. Participants - Major European institutional investors 3. Purpose - Briefing on business status to major institutional investors 4. Format - Group conference call 5. Sponsoring Organization - CLSA Securities 6. Key Briefing Contents (Summary) - Hanmi Semiconductor: Entry into New Markets 1. System Semiconductor (Foundry, OSAT) market: Launch of 2.5D Package TC Bonders (Models 40 and 120) 2. HBF (High Bandwidth Flash) market: Launch of a new-concept TC Bonder responding to expanding AI semiconductor memory demand 3. US AI semiconductor market: Participation in the US-led AI semiconductor alliance → Responding to demand for AI packaging equipment 7. Decision Date: 2026-05-11 8. IR Materials - Posting date/time: - - Related webpage: - 9. Other Material Information Relevant to Investment Decisions - The schedule of this IR event may change depending on company circumstances. ※ Related Disclosures: -