IR Meetings at 2026 Korea Conference Highlighting New AI Chip Market Entry
Original: 기업설명회(IR)개최(안내공시)
Summary
The company will participate in the '2026 Korea Conference' on June 16-17, 2026, hosted by Merrill Lynch, holding one-on-one and group meetings with major domestic and international institutional investors in Seoul. Management plans to highlight expansion into new markets, including the AI system semiconductor space (foundry/OSAT) with the launch of 2.5D Package TC Bonders (40/120) and the High Bandwidth Flash (HBF) market with a new-concept TC Bonder addressing growing AI memory demand. The company also emphasized its participation in the US-led AI semiconductor alliance, positioning itself to supply AI packaging equipment to big tech, memory, and foundry players. This IR signals an aggressive push beyond its core HBM TC bonder franchise into broader AI packaging opportunities.