IR Meeting at Macquarie Asia Conference 2026 in Hong Kong
Original: 기업설명회(IR)개최(안내공시)
Summary
The company will participate in the Macquarie Asia Conference 2026 in Hong Kong from May 18-20, holding one-on-one and group meetings with major overseas institutional investors. Management plans to present three new market entries: 2.5D Package TC Bonders (40/120) for the AI system semiconductor foundry/OSAT market, a new-concept TC Bonder for the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in the US-led AI semiconductor alliance with Big Tech, memory, and foundry players. The event is sponsored by Macquarie Securities and aims to position the company as a key supplier of AI packaging equipment. This is a proactive overseas IR targeting foreign institutional capital, with concrete product roadmap disclosures that go beyond typical conference attendance.