ITEQ Corporation News

High Tech (5439-TW), a Taiwan PCB specialist, posted a May 2026 monthly revenue record of NT$455M (+18.7% MoM, +24.6% YoY), with Jan–May cumulative revenue at NT$1.92B (+10.6% YoY). The company has secured a position in Amazon's AWS Trainium 3 AI training chip mainboard supply chain, supplying 26-layer, low-loss copper-foil boards alongside newly added switch boards that increase PCB unit count per AI rack. The ramp signals broadening demand for high-layer, thick-copper PCBs extending to general server platform upgrades and 48V power architecture transitions across hyperscaler capex cycles.

Why it matters: Confirms AWS Trainium 3 PCB ramp with a new monthly revenue record, a meaningful demand signal for the AI server PCB supply chain, but the primary subject (5439-TW) is outside the tracked ticker universe.

King Board Copper Foil (8358-TW), an upstream CCL supplier, reported cumulative Jan–May 2026 EPS of NT$3.52 on surging AI server, high-speed switch, and premium PCB demand. Processing fees for high-end copper foil have already risen 5–10% YTD with further hikes likely in H2, while genuine HVLP4 volume demand is expected to accelerate sharply from Q3 into Q4. The company is building a 3rd plant adding four HVLP production lines (~600 MT/month capacity), targeting full commissioning in Q4 2027.

Why it matters: Meaningful AI PCB supply-chain demand signal with concrete pricing and capacity data, but the primary company (8358) sits outside the tracked universe, limiting direct portfolio impact to indirect reads on tracked CCL and PCB names.

A Taiwan-licensed analyst flags week-on-week institutional and large-shareholder accumulation across AI-linked semis during the recent market correction: CCL maker 聯茂 (6213) saw large-holder share jump +8% in one week and CoWoS substrate maker 南電 (8046) attracted concentrated foreign-fund buying, while passive-component maker 華新科 (2492) is cited as a domestic-fund accumulation target. The bull thesis centers on TSMC's (2330) forthcoming earnings call, where consensus expects FY26 EPS of NT$100–110 per share and FY27 NT$140, alongside projected H2 demand acceleration from AI agent deployment at major cloud hyperscalers.

Why it matters: Provides useful AI-chain positioning intelligence (institutional flow, large-holder share changes) for tracked names 6213, 8046, and 2492, but the source is a retail-oriented opinion column rather than a hard corporate event.

Taiex closed +211.66 pts at 46,255 on NT$1.31T turnover after Micron's strong results and HBM/AI-server demand outlook lifted memory and packaging-related names. Macquarie raised TSMC (2330) target to NT$3,380 (Outperform), forecasting EPS of NT$99 in 2026 and NT$129.9 in 2027; Nanya Tech (2408), Winbond (2344), ABF substrate makers Unimicron (3037)/Kinsus (3189)/Nan Ya PCB (8046, limit-up), and CCL maker Iteq (6213, limit-up) all surged.

Why it matters: Daily market wrap with sector rotation commentary and a sell-side target hike on TSMC, but no single company-specific catalyst beyond Micron's read-through to memory/substrate supply chain.

TPCA reported Q1 2026 Taiwan-maker PCB output of NT$245.6B (~US$7.6B), +19.6% YoY and a record first quarter, driven by substrates, HLC and HDI for AI servers. TPCA guides Q2 to NT$256.1B (+17.4% YoY) and full-year 2026 to NT$1.053T (+15.1%), with tight high-end copper foil and glass fabric supply lifting prices.

Why it matters: Industry-wide TPCA market data with positive read-through to AI-server PCB/substrate suppliers but no company-specific catalyst.

Taiwanese ABF substrate maker Unimicron (3037) is reportedly committing ~NT$14B in new capex to scale production for NVIDIA's next-gen Vera Rubin AI platform, with brokers targeting 45% global ABF share and a NT$890 price target. Six related PCB names are also flagged as beneficiaries of the Vera Rubin AI-server build-out.

Why it matters: Direct, ticker-level event: NVIDIA Vera Rubin order win plus a large capex commitment for a tracked Taiwanese ABF/PCB supplier in our universe.

Fed and Taiwan's central bank both held rates steady, with Fed dot plot removing rate-cut bias and signaling possible hikes; TAIEX still closed at a record 46,465 (+1.28%) on Thursday, led by TSMC and IC design/packaging names. TSMC is accelerating CoPoS advanced packaging on 310x310mm panels with 2026 as a key validation year for equipment/material suppliers, pilot production in 2027 and mass production in 2H28; Chenbro (4916) won an AST SpaceMobile LEO satellite comms module order with Q4 pilot shipments.

Why it matters: Weekly recap mixing macro (rate decisions, US-Iran MoU) with a concrete TSMC CoPoS roadmap and a small contract win; roadmap details affect the advanced-packaging supply chain but no fresh capex or earnings number.

The TAIEX briefly broke above 44,000 for a fresh record high on strength in TSMC (2330) and UMC (2303) before turning negative as TSMC slipped 0.43% and Hon Hai (2317) fell 0.57%. Memory names rallied with Winbond (2344) near limit-up and Macronix (2337) +4%, while ABF substrate trio Unimicron (3037), Nan Ya PCB (8046) and Kinsus all advanced 2-4% alongside CCL plays like Taiwan Union Tech (6213).

Why it matters: Broad market open recap with sector rotation into memory and PCB/ABF substrates — relevant supply-chain color but no single stock-moving catalyst.