ASE Technology Holding

ASE Technology Holding is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., to disclose the acquisition of machinery and equipment for operational use from Hong Jin Precision Co., Ltd. (鴻勁精密股份有限公司). This represents a capital expenditure by a core operating subsidiary, relevant to investors monitoring ASE's production capacity and capex cycle. Full body available on MOPS.

ASE Technology Holding is disclosing, on behalf of its subsidiary ASE Test Limited, the material resolutions passed at ASE Test Limited's 2026 Annual General Meeting of Shareholders. AGM resolutions typically cover items such as dividend distributions, director elections or re-elections, amendments to the articles of incorporation, and capital-related proposals. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary Real Tech Holdings Limited, has announced that the subsidiary's board of directors has passed a resolution to acquire an equity stake in an undisclosed entity. Equity acquisitions of this nature can signal strategic expansion, vertical integration, or new business partnerships, and investors should monitor the full disclosure for deal size, target identity, and financing terms. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of facility engineering works (廠務工程) for operational use from Chang-Ding Engineering Co., Ltd. This type of disclosure is required under TWSE rules when the contract value meets the materiality threshold relative to the subsidiary's net assets or paid-in capital. Full body available on MOPS.

ASE Technology Holding intends to subscribe to newly issued common shares of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) in connection with SPIL's cash capital increase. This filing supplements an earlier disclosure made on August 10, 2026 (ROC Year 115), suggesting amended or additional details regarding the subscription terms or scale. The transaction represents a direct capital injection into a key operating subsidiary and may affect ASE's consolidated financials and ownership structure. Full body available on MOPS.

ASE Technology Holding is filing on behalf of its key subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) to disclose a board resolution approving a cash capital increase through the issuance of new shares; this filing supplements an earlier announcement made on August 10, 2026. Cash capital increases dilute existing shareholders and signal the subsidiary's intent to raise fresh equity, making the pricing, allocation, and use-of-proceeds details material to investors. Full body available on MOPS.

ASE Technology's operating subsidiary, ASE Semiconductor Manufacturing Co., Ltd., has disclosed the acquisition of machinery and equipment for business use from Jiachen Technology Co., Ltd. (佳宸科技). The transaction represents a capital expenditure disclosure required under TWSE material-information rules when asset acquisitions exceed regulatory thresholds. Full body available on MOPS.

ASE Technology Holding is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., to disclose the acquisition of machinery and equipment for operational use from BESI SINGAPORE PTE., LTD. BESI is a leading global supplier of semiconductor back-end packaging equipment (die bonding, molding, etc.), making this consistent with ongoing investment in advanced packaging capacity. Full contract value and delivery terms are available only in the MOPS filing body.

ASE Technology Holding reported Q2 2026 revenue of NT$364.7B, operating income of NT$38.6B (operating margin ~10.6%), and net income after tax of NT$36.1B, yielding basic EPS of NT$8.04. Non-operating items contributed a net NT$5.2B, supporting bottom-line results above the operating line. Performance reflects robust outsourced semiconductor assembly and test (OSAT) demand, particularly from advanced packaging driven by AI accelerator supply chains.

ASE Technology Holding, acting on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), discloses that SPIL's board of directors has resolved to raise capital through a cash subscription by issuing new shares. This equity financing event is material to investors as it will dilute SPIL's existing shareholding structure and inject fresh capital into the subsidiary, with potential implications for ASE's consolidated equity and balance sheet. Full body available on MOPS.

ASE Technology Holding is announcing on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) that SPIL has obtained a factory facilities engineering engagement, likely a construction or plant-infrastructure contract meeting TWSE material-disclosure thresholds. The detail of contract value, counterparty, scope, and timeline are not available from the subject line alone; investors should consult the full filing on MOPS for those specifics. Full body available on MOPS.

ASE Technology Holding is filing on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) to announce the acquisition of a factory engineering works contract. This type of disclosure is typically triggered in Taiwan when a contract meets statutory materiality thresholds relative to the filing entity's net worth or revenue. Full body available on MOPS.

ASE Technology Holding has issued a material information announcement on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), disclosing that SPIL has obtained facility engineering works. Such acquisitions are reportable under TWSE disclosure rules when they meet prescribed thresholds, suggesting the contract or asset value is material relative to SPIL's capital base. Full body available on MOPS.

ASE Technology Holding is making this announcement on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., whose board of directors has resolved to issue new shares through a cash capital increase. A cash capital increase at a major operating subsidiary typically signals a need for fresh equity funding, potentially to support capacity expansion, capital expenditure, or balance-sheet strengthening. Full body available on MOPS.

ASE Technology Holding intends to subscribe to newly issued ordinary shares of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd. (ASE Semiconductor), in connection with a cash capital increase by that subsidiary. The transaction represents an injection of capital from the parent into an operating subsidiary, which may signal planned capacity expansion, working capital needs, or strategic investment at the subsidiary level. Full body available on MOPS.

ASE Technology Holding intends to subscribe for newly issued ordinary shares in its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) as part of SPIL's cash capital increase. The transaction will result in ASE injecting additional capital into SPIL, with potential implications for ASE's ownership percentage and consolidated balance sheet. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment intended for business operations from Chih Sheng Industrial Co., Ltd. (志聖工業). The disclosure meets Taiwan's material-information reporting threshold, suggesting the purchase amount is material relative to the subsidiary's paid-in capital. Full body available on MOPS.

ASE Technology Holding is filing this disclosure on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), announcing that SPIL has obtained a facility engineering contract or project award. Such announcements are typically required under TWSE material-information rules when a subsidiary secures a plant-related engineering engagement that meets the regulatory disclosure threshold; the scale and counterparty are detailed in the full MOPS filing. Full body available on MOPS.

ASE Technology Holding is announcing, on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), that SPIL has obtained a facility engineering contract or works award. This type of announcement typically relates to a capital construction or plant infrastructure project; the contract scope and value—key details for assessing materiality—are disclosed in the full filing body available on MOPS. Full body available on MOPS.

ASE Technology Holding is announcing, on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), that SPIL has acquired a facility engineering contract or services agreement. Such disclosures are typically required under TWSE rules when the contract value meets a materiality threshold relative to the subsidiary's net assets. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the procurement of machinery and equipment for operational use from the Taiwan branch of Advanced Pacific Co., Ltd. (a Hong Kong-registered entity). The disclosure suggests the acquisition meets the materiality threshold under TWSE rules, making it a reportable capital expenditure. Full body available on MOPS.

ASE Technology Holding is filing this announcement on behalf of its key subsidiary, ASE Semiconductor Manufacturing Co., Ltd., disclosing the acquisition of machinery and equipment for operational use from Wanrun Technology Co., Ltd. (萬潤科技股份有限公司). This represents a capital expenditure investment in production or testing equipment, relevant to investors monitoring the subsidiary's capacity expansion or equipment upgrade cycle. Full body available on MOPS.

ASE Technology Holding (3711) is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., disclosing the acquisition of machinery and equipment for operational use from Krael Technology Co., Ltd. Equipment procurement of this nature is a routine capital expenditure common in semiconductor back-end manufacturing. Full details including transaction value and timeline are available on MOPS.

ASE Technology Holding is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., to disclose the acquisition of machinery and equipment for operational use from Japan's Fuji Corporation. The purchase represents a capital expenditure to support or expand manufacturing capacity at the subsidiary level. Full body available on MOPS.

ASE Technology Holding filed this material disclosure on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., announcing the acquisition of machinery and equipment for operational use from Ju Rong Technology Co., Ltd. (聚嶸科技股份有限公司). The filing indicates a capital expenditure commitment for production capacity or process tooling, though the transaction value, equipment type, and strategic rationale are not determinable from the subject line alone. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its core operating subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment for business operations from Wanrun Technology Co., Ltd. (TWSE: 6243), a Taiwanese manufacturer known for semiconductor burn-in test and thermal-management equipment. The disclosure indicates a capital expenditure commitment of sufficient scale to trigger Taiwan's material-information reporting threshold, suggesting meaningful capacity investment. Full body available on MOPS.

ASE Technology Holding has announced the completion of pricing for its first offshore unsecured convertible bond offering in ROC Year 115 (2026). This is a notable capital markets event as convertible bonds represent a hybrid debt instrument with potential equity dilution upon conversion, affecting both the company's capital structure and existing shareholders. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment for operational use from Disco Hi-Tech Co., Ltd. (the Taiwan affiliate of Japan's DISCO Corporation, a leading supplier of precision dicing and grinding tools used in semiconductor packaging). The disclosure indicates the transaction meets TWSE materiality thresholds for equipment purchases, signalling continued capex investment in packaging/assembly capacity. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment for operational use from Aurigin Technology Pte. Ltd., a Singapore-incorporated entity. This type of disclosure is required under TWSE rules when capital expenditure on equipment from a single counterparty meets the materiality threshold. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary Taiwan Furen Electronics Co., Ltd., discloses the acquisition of facility engineering services for operational use from Morisen Construction Engineering Co., Ltd. The contract pertains to plant/facility infrastructure works necessary for business operations. Full body available on MOPS; the financial value and project timeline are not available from the subject line alone.

ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., announced the acquisition of a manufacturing plant and ancillary facilities located in Luzhu (Kaohsiung). Luzhu is already home to a core ASE packaging and testing campus, so this acquisition likely represents a capacity expansion or consolidation of adjacent assets at a strategically critical site. Full body available on MOPS.

ASE Technology Holding is announcing, on behalf of its subsidiary Huan Hong Technology Co., Ltd. (環鴻科技), that the subsidiary's Board of Directors has passed resolutions exercising the powers of an Extraordinary General Meeting (EGM)—a mechanism permitted under Taiwan's Company Act when qualifying conditions are met. The specific resolutions adopted are not available from the subject line alone, but EGM-level actions typically cover significant matters such as capital structure changes, amendments to the articles of incorporation, or major asset transactions. Full body available on MOPS.

ASE Technology Holding filed this material disclosure on behalf of its wholly-owned subsidiary, ASE Semiconductor Manufacturing Co., Ltd., announcing the acquisition of land parcels and the structures built upon them located in the Zhongli Industrial Zone (Taoyuan City, Taiwan). The transaction expands the subsidiary's controlled industrial footprint in a key semiconductor manufacturing corridor and may indicate capacity build-out plans. Full body available on MOPS.

ASE Technology Holding has announced the scheduling of its Q2 2026 institutional investor conference (法人說明會), which typically serves as the company's quarterly earnings briefing for analysts and institutional shareholders. This event is where management presents financial results, operational highlights, and forward-looking commentary, making it a key touchpoint for investors monitoring the company's performance in the semiconductor packaging and testing sector. Full body available on MOPS.

ASE Technology Holding, acting on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), has disclosed the acquisition of operating machinery and equipment with a cumulative value reaching NT$1 billion — the regulatory threshold that triggers mandatory disclosure under TWSE rules. The investment signals continued capacity build-out at SPIL's packaging and testing operations. Full body available on MOPS.

ASE Technology Holding has filed this disclosure on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), announcing that SPIL's cumulative acquisition of operational machinery and equipment has reached NT$1 billion, triggering the mandatory TWSE material-information threshold. The expenditure signals ongoing capacity investment at SPIL's advanced packaging operations, relevant to investors tracking semiconductor back-end capex trends. Full body available on MOPS.

ASE Technology Holding is filing this disclosure on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., which is procuring machinery and equipment for operational use from Lam Research International Sdn. Bhd, the Malaysian affiliate of U.S. semiconductor equipment leader Lam Research. The purchase indicates ongoing capital expenditure to maintain or expand back-end semiconductor manufacturing capacity. Full body available on MOPS.

ASE Technology Holding is filing on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) to disclose the acquisition of operating machinery and equipment with an aggregate value reaching NT$1 billion, triggering mandatory TWSE disclosure thresholds. The expenditure signals continued capacity investment at SPIL and is material to investors assessing ASE's near-term capex trajectory and packaging/testing capacity build-out. Full body available on MOPS.

ASE Technology Holding filed this material disclosure on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), reporting the acquisition of operational machinery and equipment with a combined value reaching NT$1 billion — the regulatory threshold triggering mandatory disclosure under TWSE rules. This level of capital expenditure signals continued capacity investment in SPIL's IC packaging and testing operations. Full body available on MOPS.

ASE Technology Holding, acting as filing agent, discloses that its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) has completed acquisition of operational machinery and equipment with a cumulative value reaching NT$1 billion (approx. US$31 million), triggering a mandatory material-information filing under TWSE disclosure rules. The purchase signals continued capital expenditure and capacity build-out within SPIL's semiconductor packaging and testing operations. Full body available on MOPS.

ASE Technology Holding is disclosing, on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), that SPIL has procured operational machinery and equipment with an aggregate value reaching NT$1 billion (approximately USD $31 million at current rates). The disclosure is mandated under Taiwan's material-information reporting rules, which require listed companies to report asset acquisitions above prescribed thresholds. The capital outlay points to ongoing capacity investment in SPIL's IC packaging and testing operations. Full body available on MOPS.

ASE Technology Holding is filing on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) to announce that SPIL has obtained a facility (plant) engineering works contract or procurement. This type of disclosure typically relates to a capital expenditure commitment for plant construction, expansion, or infrastructure upgrades at SPIL's manufacturing facilities. Full body available on MOPS.

ASE Technology Holding is announcing, on behalf of its Malaysian subsidiary ASE Electronics (M) Sdn. Bhd., the acquisition of facility engineering works for operational use from Marketech International Sdn. Bhd. This signals a procurement contract for plant/factory facility services at the Malaysian operations, which has crossed the TWSE materiality disclosure threshold. Full body available on MOPS.

ASE Technology Holding has filed a material-information announcement on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), disclosing that SPIL's acquisition of operational machinery and equipment has reached or exceeded NT$1 billion, triggering the mandatory TWSE disclosure threshold. The announcement signals continued capital investment in SPIL's IC packaging and testing capacity. Full body available on MOPS.

ASE Technology Holding is disclosing, on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), that SPIL has acquired operating machinery and equipment with an aggregate value reaching NT$1 billion (TWD). Under Taiwan Stock Exchange rules, asset acquisitions meeting or exceeding this threshold trigger mandatory material-event disclosure, signalling a meaningful capital expenditure commitment by SPIL in its semiconductor packaging and testing operations. Full body available on MOPS.

ASE Technology Holding has filed a material disclosure on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), announcing that SPIL has acquired factory/plant engineering works — likely a capital-expenditure procurement or facility construction contract. The subject line appears truncated; key details such as contract value, counterparty, and project scope are available in the full body on MOPS. Investors should note the announcement as a routine capex item unless the contract value triggers disclosure thresholds significant to SPIL's balance sheet.

ASE Technology Holding is announcing on behalf of its subsidiary Siliconware Precision Industries Co., Ltd. (SPIL) that SPIL has obtained a facility (plant) engineering contract or project. The subject line is truncated and full contractual details — including counterparty, scope, and value — are not available from the subject alone; full body available on MOPS.

ASE Technology Holding is filing this disclosure on behalf of its wholly-owned subsidiary Siliconware Precision Industries Co., Ltd. (SPIL), announcing that SPIL has obtained (acquired) facility/plant engineering works — likely a construction or facility-upgrade contract. The announcement signals ongoing capital expenditure activity at SPIL's manufacturing operations, which may affect near-term capex guidance. Full body available on MOPS.