Subsidiary Acquires Business-Use Machinery & Equipment from Mirle Automation
Original: 代子公司日月光半導體製造(股)公司公告 向盟立自動化股份有限公司取得供營業用之機器設備
Summary
ASE Technology Holding is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., to disclose the acquisition of machinery and equipment for operational use from Mirle Automation Corporation (盟立自動化股份有限公司), a Taiwanese industrial automation company. This type of disclosure is required under TWSE rules when a listed company or its material subsidiaries procure equipment above certain value thresholds. Full body available on MOPS.
Full Translation
Subject line (translated): 'Announcement filed on behalf of subsidiary ASE Semiconductor Manufacturing Co., Ltd. — Acquisition of machinery and equipment for business use from Mirle Automation Corporation.' ASE Technology Holding (TWSE: 3711), acting as the reporting parent, is disclosing a capital equipment procurement by its core operating subsidiary, ASE Semiconductor Manufacturing Co., Ltd. The counterparty, Mirle Automation Corporation, is a Taiwan-listed industrial automation and smart-factory solutions provider. Under TWSE material information regulations, equipment acquisitions meeting applicable monetary or asset-ratio thresholds must be publicly disclosed; this filing indicates the transaction crossed such a threshold. The specific contract value, delivery schedule, and intended production application are not available from the subject line alone. [Body not available — subject line only. See MOPS for full announcement.]