Subsidiary ASE Semiconductor to Acquire Production Machinery from BESI Singapore
Original: 代子公司日月光半導體製造(股)公司公告 向BESI SINGAPORE PTE., LTD.取得供營業用之機器設備
Summary
ASE Technology Holding is filing on behalf of its subsidiary, ASE Semiconductor Manufacturing Co., Ltd., to disclose the acquisition of machinery and equipment for operational use from BESI SINGAPORE PTE., LTD. BESI is a leading global supplier of semiconductor back-end packaging equipment (die bonding, molding, etc.), making this consistent with ongoing investment in advanced packaging capacity. Full contract value and delivery terms are available only in the MOPS filing body.
Full Translation
Parent company announcement filed on behalf of subsidiary ASE Semiconductor Manufacturing Co., Ltd. (日月光半導體製造股份有限公司): the subsidiary has entered into a transaction to acquire machinery and equipment for business operations from BESI SINGAPORE PTE., LTD. BESI Singapore is the Asia-Pacific entity of BE Semiconductor Industries N.V. (Besi), a Dutch equipment maker specialising in advanced semiconductor assembly and packaging tools. The disclosure is made pursuant to TWSE material-information reporting obligations triggered when equipment purchases exceed regulatory thresholds. [Body not available — subject line only. See MOPS for full announcement.]