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Kinsus Interconnect Technology (3189) | Silicon Nexus

3189

Kinsus Interconnect Technology

킨서스 인터커넥트

Price

Supply Chain Position

Substrate

Designs and manufactures IC substrates (BGA, FC-CSP, FC-BGA) and PCBs used to package logic, memory and networking chips.

Suppliers

Ajinomoto Fine-Techno
Mitsubishi Gas Chemical

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Kinsus Interconnect Technology

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Customers

Nvidia
MediaTek
AMD

Competitors

UnimicronNan Ya PCBIbiden

Recent Disclosures (7)

Jul 8, 2026medium
Company Places Order for Machinery and Equipment
Kinsus Interconnect Technology (3189) has announced the placement of a purchase order for machinery and equipment. For a substrate and HDI PCB manufacturer, equipment orders typically signal capacity expansion or technology upgrade investment, which may affect future production capacity and capital expenditure outlook. Full body available on MOPS.

Shinko Electric

Semco

Notes

Kinsus is a Taiwanese ABF/BT substrate maker majority-owned by Pegatron/ASE group, and a key supplier of flip-chip substrates for HPC, AI accelerators and smartphone APs. The company has invested in FC-BGA capacity expansion to serve AI/HPC demand, but faces cyclical pricing pressure as Japanese (Ibiden, Shinko) and Korean (Semco) incumbents dominate the high-end ABF segment.

See Kinsus Interconnect Technology in the full network map

Jul 2, 2026medium

Order Placed for Machinery and Equipment Purchase

Kinsus Interconnect Technology (3189) has announced the placement of an order for machinery and equipment, triggering a material information disclosure under TWSE regulations. Such filings are required when capital expenditure commitments exceed regulatory thresholds, indicating a meaningful capacity or technology investment. Full body available on MOPS.

Jun 23, 2026medium

Material Information Disclosure Triggered by Attention-Stock Designation

Kinsus Interconnect's shares met TWSE criteria for designation as an 'attention' (注意) stock due to abnormal trading activity, requiring the company to publicly disclose material financial and business information so investors can assess the situation. The filing itself is a regulatory response to market trading patterns rather than a new operational event. Full body available on MOPS.

Jun 16, 2026medium

Sets Ex-Dividend Record Date for FY2026 Cash Dividend

Kinsus Interconnect Technology announced the ex-dividend record date for its FY2026 (ROC year 115) cash dividend distribution. This filing establishes the cutoff for shareholders entitled to receive the upcoming dividend payment. Full body available on MOPS.

Jun 16, 2026medium

Adjustment to Cash Dividend Payout Ratio

The board has resolved to adjust the company's cash dividend payout ratio, signaling a change in capital return policy. The revised payout ratio may affect per-share cash dividends and yield expectations for shareholders. Full body available on MOPS.

Jun 17, 2026high

May 2026 Revenue: NT$4.2B, +33.0% YoY

Kinsus Interconnect reported May 2026 revenue of NT$4.20B, up +33.0% YoY and +3.1% MoM, marking a strong acceleration over the prior month's base of NT$4.07B. The sustained double-digit YoY growth — paired with YTD revenue of NT$19.38B (+29.3% YoY) — reinforces the AI-driven IC substrate upcycle, with FC-BGA demand from AI accelerator and HPC packaging likely the key driver.

Jul 9, 2026medium

Q1 2026 Earnings: Revenue NT$11.1B, EPS NT$1.17

Kinsus Interconnect Technology (3189) reported Q1 2026 revenue of NT$11.10B with operating income of NT$890.6M and net income after tax of NT$875.8M. Basic EPS came in at NT$1.17, a steady in-line print for the IC substrate maker as the semiconductor packaging cycle continues its gradual recovery.