3189
킨서스 인터커넥트
Suppliers
Kinsus Interconnect Technology
Customers
Competitors
Kinsus Interconnect Technology announces the completion of its repurchase and cancellation of previously issued restricted employee stock shares (限制員工權利新股). These shares, originally granted to employees under a restricted stock plan, have been bought back by the company and formally deregistered, reducing the total shares outstanding. This is a routine administrative closure of a prior equity-compensation cycle and has a modest positive effect on per-share metrics due to the reduction in share count. Full body available on MOPS.
Notes
Kinsus is a Taiwanese ABF/BT substrate maker majority-owned by Pegatron/ASE group, and a key supplier of flip-chip substrates for HPC, AI accelerators and smartphone APs. The company has invested in FC-BGA capacity expansion to serve AI/HPC demand, but faces cyclical pricing pressure as Japanese (Ibiden, Shinko) and Korean (Semco) incumbents dominate the high-end ABF segment.
Kinsus Interconnect Technology (3189) reported Q2 2026 revenue of NT$23.6B with net income of NT$2.56B, yielding basic EPS of NT$3.74. Operating income reached NT$2.57B, translating to an operating margin of approximately 10.9%, a solid result for an IC substrate manufacturer. Non-operating items contributed a net NT$179.5M, broadly in line with expectations for the semiconductor packaging materials segment.