3189
킨서스 인터커넥트
Source: dsi_quarterly · analyst_consensus (internal DB). DSI from quarterly filings; consensus as of collection.
Suppliers
Kinsus Interconnect Technology
Customers
Competitors
Notes
Kinsus is a Taiwanese ABF/BT substrate maker majority-owned by Pegatron/ASE group, and a key supplier of flip-chip substrates for HPC, AI accelerators and smartphone APs. The company has invested in FC-BGA capacity expansion to serve AI/HPC demand, but faces cyclical pricing pressure as Japanese (Ibiden, Shinko) and Korean (Semco) incumbents dominate the high-end ABF segment.
Kinsus Interconnect Technology (3189) reported Q2 2026 revenue of NT$23.6B with net income of NT$2.56B, yielding basic EPS of NT$3.74. Operating income reached NT$2.57B, translating to an operating margin of approximately 10.9%, a solid result for an IC substrate manufacturer. Non-operating items contributed a net NT$179.5M, broadly in line with expectations for the semiconductor packaging materials segment.
Kinsus Interconnect Technology (3189) has announced that it obtained engineering-related information, likely pertaining to a technical project, customer specification, or facility/process development relevant to its IC substrate and PCB operations. The precise scope, counterparty, and financial implications are not determinable from the subject line alone. Full body available on MOPS.
Kinsus Interconnect Technology filed a material information disclosure to address and clarify coverage appearing in media reports, as required under Taiwan's stock exchange regulations when such reports may affect investor perception or share price. The specific content of the clarification and the media reports in question are not available from the subject line alone; investors should consult the full announcement on MOPS to assess materiality. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has been invited to attend an investment forum organized by Citi Securities. Such disclosures are standard Taiwan regulatory practice, notifying investors that management will be presenting to institutional audiences. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has been invited to participate in an investor forum organized by President Securities Corporation. Such events typically involve a company presentation to institutional and retail investors, offering an opportunity to communicate business strategy and financial outlook. Full body available on MOPS.
Kinsus Interconnect Technology (3189) filed a material information disclosure to clarify or respond to media coverage. Clarification filings are typically triggered when circulating reports—often relating to M&A activity, major contracts, financial performance, or production plans—may be inaccurate or require official comment. Full body available on MOPS.
Kinsus Interconnect Technology has been invited to attend an investor forum organized by Cathay Securities. This is a routine investor relations event, likely involving a management presentation or Q&A session with institutional clients. Full body available on MOPS.
Kinsus Interconnect Technology announces the completion of its repurchase and cancellation of previously issued restricted employee stock shares (限制員工權利新股). These shares, originally granted to employees under a restricted stock plan, have been bought back by the company and formally deregistered, reducing the total shares outstanding. This is a routine administrative closure of a prior equity-compensation cycle and has a modest positive effect on per-share metrics due to the reduction in share count. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has announced a personnel change in the position of Head of Internal Audit. Under Taiwan's Securities and Exchange Act and FSC regulations, listed companies are required to disclose such changes as a material event, as the internal audit function is central to corporate governance, risk management, and regulatory compliance. Full body available on MOPS.
Kinsus Interconnect Technology's Board of Directors has resolved to delegate authority to the Chairman to proceed with the purchase of real property on the company's behalf. The nature, scale, and purpose of the acquisition are not yet disclosed; full details are available on MOPS (Market Observation Post System). Investors should monitor the full announcement to assess the size of the capital commitment and its strategic rationale.
Kinsus Interconnect Technology's Board of Directors has resolved to approve a new incremental capital expenditure budget for specific projects. For a substrate and interconnect manufacturer operating in the semiconductor supply chain, a board-sanctioned capex addition typically signals capacity expansion, new equipment procurement, or technology upgrade commitments that will affect near-term cash flow and medium-term production capacity. Full body available on MOPS.
Kinsus Interconnect Technology's board of directors has resolved to repurchase and cancel restricted new shares previously issued to employees under the company's restricted stock award program. Such cancellations typically arise when shares are forfeited due to employee departure or failure to satisfy vesting conditions, and result in a reduction of total issued share capital. Full body available on MOPS.
Kinsus Interconnect Technology's Board of Directors has resolved to approve the company's consolidated financial report for the second quarter of 2026 (Republic of China Year 115). Board approval is a mandatory step under Taiwan's Securities and Exchange Act before quarterly financials can be filed with regulators and made public. Full body available on MOPS.
Kinsus Interconnect Technology (3189) reported Q1 2026 revenue of NT$11.10B with operating income of NT$890.6M and net income after tax of NT$875.8M. Basic EPS came in at NT$1.17, a steady in-line print for the IC substrate maker as the semiconductor packaging cycle continues its gradual recovery.
Kinsus Interconnect Technology (3189) has disclosed that its Board of Directors will convene on July 31, 2026 to review and adopt the company's second-quarter 2026 financial report. This is a standard pre-notification required under Taiwan Stock Exchange listing rules, giving investors advance notice of when quarterly results will be formally approved. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has disclosed that it has placed orders for machinery and equipment, indicating a capital expenditure commitment likely related to capacity expansion or process-technology upgrades. For an IC substrate and PCB manufacturer such as Kinsus, equipment procurement decisions signal the company's near-term production capacity trajectory and should be monitored alongside backlog and utilisation trends. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has announced the placement of a purchase order for machinery and equipment. For a substrate and HDI PCB manufacturer, equipment orders typically signal capacity expansion or technology upgrade investment, which may affect future production capacity and capital expenditure outlook. Full body available on MOPS.
Kinsus Interconnect Technology (3189) has announced the placement of an order for machinery and equipment, triggering a material information disclosure under TWSE regulations. Such filings are required when capital expenditure commitments exceed regulatory thresholds, indicating a meaningful capacity or technology investment. Full body available on MOPS.
Kinsus Interconnect's shares met TWSE criteria for designation as an 'attention' (注意) stock due to abnormal trading activity, requiring the company to publicly disclose material financial and business information so investors can assess the situation. The filing itself is a regulatory response to market trading patterns rather than a new operational event. Full body available on MOPS.
Kinsus Interconnect reported May 2026 revenue of NT$4.20B, up +33.0% YoY and +3.1% MoM, marking a strong acceleration over the prior month's base of NT$4.07B. The sustained double-digit YoY growth — paired with YTD revenue of NT$19.38B (+29.3% YoY) — reinforces the AI-driven IC substrate upcycle, with FC-BGA demand from AI accelerator and HPC packaging likely the key driver.
The board has resolved to adjust the company's cash dividend payout ratio, signaling a change in capital return policy. The revised payout ratio may affect per-share cash dividends and yield expectations for shareholders. Full body available on MOPS.
Kinsus Interconnect Technology announced the ex-dividend record date for its FY2026 (ROC year 115) cash dividend distribution. This filing establishes the cutoff for shareholders entitled to receive the upcoming dividend payment. Full body available on MOPS.