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May 2026 Revenue: NT$4.2B, +33.0% YoY — Kinsus Interconnect Technology | Silicon Nexus

3189 · Kinsus Interconnect Technology· Filed June 17, 20268-Khigh

May 2026 Revenue: NT$4.2B, +33.0% YoY

Original: 2026年5月月營收 - 4,199,867千元 (MoM +3.1%, YoY +33.0%)

Summary

Kinsus Interconnect reported May 2026 revenue of NT$4.20B, up +33.0% YoY and +3.1% MoM, marking a strong acceleration over the prior month's base of NT$4.07B. The sustained double-digit YoY growth — paired with YTD revenue of NT$19.38B (+29.3% YoY) — reinforces the AI-driven IC substrate upcycle, with FC-BGA demand from AI accelerator and HPC packaging likely the key driver.

Historical Impact

1 past Monthly Revenue · ≈ 8-K event at Kinsus Interconnect Technology

Median +5d

+32.48%

Range

+32.48% to +32.48%

Positive outcomes

1/1

Filed	P₀	P₊₅	+5d
May 17, 2026	NT$505	NT$669	+32.48%

Past performance does not guarantee future results. Small sample sizes may not be representative. For informational purposes only.

Full Translation

Kinsus Interconnect Technology (TWSE: 3189) — May 2026 Monthly Revenue Filing - Current month revenue (May 2026): NT$4,199.9M (NT$4.20B) - Prior month revenue (Apr 2026): NT$4,072.3M (NT$4.07B) - Same month prior year (May 2025): NT$3,157.3M (NT$3.16B) - MoM change: +3.13% - YoY change: +33.02% YTD (Jan–May 2026): - Cumulative revenue: NT$19,377.2M (NT$19.38B) - Prior-year cumulative (Jan–May 2025): NT$14,989.9M (NT$14.99B) - YTD YoY change: +29.27% Industry: Semiconductors (IC substrate / FC-BGA packaging substrates). Notes: None disclosed.