Disclosures

SK Hynix filed its Q1 2026 quarterly report for the period January 1 to March 31, 2026, with CEO Kwak Noh-Jung signing as representative director. As of the March 31, 2026 reporting date, total authorized shares stand at 9,000,000,000 and total issued common shares at 5,721,980,209, with 708,297,021 shares in free float after treasury stock. A profit-based share retirement was executed on February 9, 2026, and treasury shares were distributed as employee bonuses on February 6, 2026. The treasury stock holding ratio stands at 0.6% (0.2% under the Capital Markets Act calculation). The report follows standard quarterly disclosure format with sections on business operations, financials, governance, and shareholder matters largely deferred to detailed sections per regulatory templates.

ISC reported Q1 2026 consolidated revenue of KRW 68.27 billion, with elastomer (silicone rubber) test sockets remaining the core business at roughly 80% of sales and an estimated ~90% global market share in that segment. The company is actively supplying AI semiconductor test sockets to global big-tech, fabless, OSAT, and ASIC customers, having entered non-memory mass production in 2023 and ramping fabless customers from 2024. ISC also consolidated its newly acquired equipment/materials businesses (iSemi, Techdream) acquired in Q2 2025, adding module testers, high-speed burn-in testers, EFEM, cleaning chemicals for DRAM/HBM etch, and PCB lines targeting the AI/HBM test market. Q1 production reached 5.48 million units (1.31M test sockets + 4.17M pogo pins), with raw materials (silicone, powder) totaling KRW 23.85 billion. Product mix: manufactured products 83.4%, merchandise 15.6%, services/other 1.0%.

Samsung Electronics reported Q1 2026 consolidated revenue of KRW 133.87 trillion, up 69.2% year-over-year, driven primarily by a dramatic ~146% increase in average memory selling prices versus the prior year average. The DS (semiconductor) division contributed KRW 81.72 trillion (61% of revenue), surpassing the DX (consumer electronics) division at KRW 52.65 trillion (39.3%), with SDC and Harman adding KRW 6.69 trillion and KRW 3.83 trillion respectively. Smartphone ASPs rose ~23% YoY while TV ASPs declined ~5%, and digital cockpit prices fell ~5%. Major customers include Alphabet, Amazon, and Apple. The report covers the 58th fiscal year quarter ending March 31, 2026, with the company operating through 310 subsidiaries globally.

Samsung Electronics revised its previously disclosed Q1 2026 transaction plan with affiliate Samsung Welstory, an entity invested in by the controlling shareholder group. Combined sales and purchases totaled KRW 138.9 billion (sales KRW 3.4B, purchases KRW 135.5B), representing 0.06% of prior-year revenue (KRW 238.0 trillion). The bulk of purchases consisted of cafeteria operation and meal services (~KRW 133B), with smaller amounts for general goods procurement. This is a routine compliance disclosure under Fair Trade Act Article 26 reflecting actual results versus the plan announced on 2025-11-28, with negligible financial materiality.

A non-registered executive (Managing Director Yoo Seung Yoon, appointed September 2024) increased his holdings from 200 to 500 common shares via an on-market purchase on May 15, 2026, at 7,460 KRW per share. The total transaction value is approximately 2.24 million KRW, and his ownership ratio remains effectively 0.00% of the 14,486,386 shares outstanding. While insider buying is generally a mildly positive signal, the trivial size of this purchase makes it largely symbolic rather than financially meaningful. The report was filed with the Securities and Futures Commission and Korea Exchange on the same day.

The company has set June 1, 2026 as the record date to determine shareholders eligible to vote at an upcoming extraordinary general meeting (EGM). The board approved this decision on May 15, 2026, pursuant to Article 16 of the company's articles of incorporation. No share transfer suspension period will be applied, in line with the Electronic Securities Act. The specific agenda of the EGM has not yet been disclosed, but investors should watch for follow-up filings detailing the meeting's purpose.

The company will participate in the Macquarie Asia Conference 2026 in Hong Kong from May 18-20, holding one-on-one and group meetings with major overseas institutional investors. Management plans to present three new market entries: 2.5D Package TC Bonders (40/120) for the AI system semiconductor foundry/OSAT market, a new-concept TC Bonder for the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in the US-led AI semiconductor alliance with Big Tech, memory, and foundry players. The event is sponsored by Macquarie Securities and aims to position the company as a key supplier of AI packaging equipment. This is a proactive overseas IR targeting foreign institutional capital, with concrete product roadmap disclosures that go beyond typical conference attendance.

The board approved a paid-in capital increase issuing 12,000,000 new common shares (20.66% of existing 58,083,006 shares) at a tentative price of KRW 4,150, raising approximately KRW 49.8 billion. Proceeds will fund KRW 30 billion in facility investment and KRW 19.8 billion in working capital. The offering uses a shareholder-allocation method with public subscription for forfeited shares, with KB Securities as lead underwriter. The record date is June 19, 2026, subscription on July 29-30, payment August 6, and new shares list August 21. A 20% discount applies to the reference price, with the final issue price set on July 27, 2026.

TSE filed its Q1 2026 quarterly report covering January 1 to March 31, 2026, the company's 32nd fiscal year. The consolidated scope includes 10 subsidiaries (3 listed, 7 unlisted), unchanged from the start of the period, with LDT Co., Ltd. newly included as a consolidated subsidiary following a third-party allocation capital increase participation in December 2025. The company's corporate credit rating was upgraded to A- in April 2025 from BBB+ a year earlier, returning to its 2023 level. TSE remains classified as a mid-sized enterprise focused on manufacturing semiconductor and display inspection equipment, with operations spanning Korea, China (Weihai, Wuhan, Hefei), the U.S. (Pleasanton, CA), and Vietnam.