Disclosures

The company reported Q1 2026 (28th fiscal year) revenue of KRW 388.8 billion, with Display Driver IC (DDI) accounting for 87.58% of sales—down from 90.17% a year earlier, signaling continued reliance on display driver chips even as the mix gradually diversifies. Exports made up 99.61% of revenue, underscoring near-total dependence on overseas customers. Sales to the top two customers fell sharply year-on-year to KRW 228.4 billion and KRW 85.7 billion (versus KRW 270.7 billion and KRW 148.7 billion), suggesting weakening orders from major panel makers. The fabless company continues to rely on TSMC, SK hynix system ic (Wuxi), and LG Innotek for wafers, while ramping its automotive heat-dissipation substrate business at the Siheung campus (250,000 units/year capacity) as a future growth driver.

Techwing filed its Q1 2026 quarterly report (25th fiscal year, Jan 1 – Mar 31, 2026). Product mix shifted meaningfully toward memory test equipment, which rose to 37.0% of revenue from 31.3% in 2025, while non-memory test equipment fell sharply to 1.7% from 5.3%. Parts and peripherals (Interface Boards, COK, upgrades) remain the largest segment at 51.0%. The company highlighted its HBM Cube Prober — a sub-5μm vision-based wafer-level HBM tester — and the TWP300/TWP300H Probe Station as key growth drivers targeting the AI-driven HBM market dominated by SK Hynix, Samsung, and Micron. One non-listed Chinese subsidiary (CK Electronics Technology Nanjing) was liquidated, reducing consolidated subsidiaries from 5 to 4.

The company has filed a securities registration statement for an equity offering of 12,000,000 new registered common shares with a total offering value of KRW 49.8 billion. The filing details key business risks tied to the semiconductor back-end (OSAT) business, including exposure to global macroeconomic conditions, downstream display and system semiconductor cycles, and the risk of in-housing by major IDM customers such as Samsung Electronics and SK hynix. Roughly 40% of revenue comes from DDI (display driver IC) bumping, with the remainder from SoC, PMIC, and CIS Non-DDI work, leaving results highly sensitive to display panel demand and non-memory chip cycles. WSTS projects the 2026 global semiconductor market to grow 26.3% YoY to USD 520.1B, and OSAT is expected to grow at a 7.81% CAGR through 2035, but customer concentration and potential policy/support changes remain material risks. KB Securities is listed as the underwriter contact.

Q1 2026 consolidated revenue reached KRW 263.8 billion, with the semiconductor segment dominating at KRW 221.9 billion (84%), followed by secondary battery (KRW 18.1B, 7%) and display (KRW 13.5B, 5%). Semiconductor material selling prices rose ~3% YoY while raw material costs jumped ~9% YoY, indicating margin pressure from input inflation. Secondary battery material input costs surged ~49% YoY against a ~3% selling price decline, signaling significant margin compression in that segment. Q1 utilization at the Gongju semiconductor plant was 53% (24,111 of 45,648 tons capacity). Key customers remain Samsung Electronics, SK hynix, Samsung Display, LG Display, Samsung SDI, SK On, and LG Energy Solution.

Samsung Electronics reported Q1 2026 consolidated revenue of KRW 133.87 trillion, up 69.2% year-over-year, driven primarily by a dramatic ~146% increase in average memory selling prices versus the prior year average. The DS (semiconductor) division contributed KRW 81.72 trillion (61% of revenue), surpassing the DX (consumer electronics) division at KRW 52.65 trillion (39.3%), with SDC and Harman adding KRW 6.69 trillion and KRW 3.83 trillion respectively. Smartphone ASPs rose ~23% YoY while TV ASPs declined ~5%, and digital cockpit prices fell ~5%. Major customers include Alphabet, Amazon, and Apple. The report covers the 58th fiscal year quarter ending March 31, 2026, with the company operating through 310 subsidiaries globally.

The company will participate in the Macquarie Asia Conference 2026 in Hong Kong from May 18-20, holding one-on-one and group meetings with major overseas institutional investors. Management plans to present three new market entries: 2.5D Package TC Bonders (40/120) for the AI system semiconductor foundry/OSAT market, a new-concept TC Bonder for the emerging HBF (High Bandwidth Flash) market driven by AI memory demand, and participation in the US-led AI semiconductor alliance with Big Tech, memory, and foundry players. The event is sponsored by Macquarie Securities and aims to position the company as a key supplier of AI packaging equipment. This is a proactive overseas IR targeting foreign institutional capital, with concrete product roadmap disclosures that go beyond typical conference attendance.

SK Hynix filed its Q1 2026 quarterly report for the period January 1 to March 31, 2026, with CEO Kwak Noh-Jung signing as representative director. As of the March 31, 2026 reporting date, total authorized shares stand at 9,000,000,000 and total issued common shares at 5,721,980,209, with 708,297,021 shares in free float after treasury stock. A profit-based share retirement was executed on February 9, 2026, and treasury shares were distributed as employee bonuses on February 6, 2026. The treasury stock holding ratio stands at 0.6% (0.2% under the Capital Markets Act calculation). The report follows standard quarterly disclosure format with sections on business operations, financials, governance, and shareholder matters largely deferred to detailed sections per regulatory templates.

Hanmi Semiconductor filed its Q1 2026 quarterly report covering January 1 to March 31, 2026, the first quarter of its 47th fiscal year. The company maintains three unlisted consolidated subsidiaries with no changes during the period. A NICE D&B credit rating renewal on April 21, 2026 assigned an AA0 grade (valid through April 20, 2027), indicating strong commercial creditworthiness and resilience to environmental changes. The filing is a routine regulatory disclosure with the detailed business performance, financial statements, and management discussion contained in subsequent sections not fully shown here. CEO Kwak Dong-shin signed the filing, with Vice President Kim Jung-young as the responsible preparer.

Wonik Holdings, the largest shareholder, reported a minor reduction in its combined holding from 32.98% to 32.95% (-18,411 shares) as of May 15, 2026. The change reflects on-market sales by special-related parties and the departure of one executive (reducing the special-related party count from 5 to 4). Wonik Holdings also extended and modified terms on an existing share-pledged loan agreement covering 7,850,000 shares (15.99%), unchanged in size. The holding purpose remains 'influence over management,' though no specific control-related actions are currently planned. Total issued shares remain 49,083,901.

ISC reported Q1 2026 consolidated revenue of KRW 68.27 billion, with elastomer (silicone rubber) test sockets remaining the core business at roughly 80% of sales and an estimated ~90% global market share in that segment. The company is actively supplying AI semiconductor test sockets to global big-tech, fabless, OSAT, and ASIC customers, having entered non-memory mass production in 2023 and ramping fabless customers from 2024. ISC also consolidated its newly acquired equipment/materials businesses (iSemi, Techdream) acquired in Q2 2025, adding module testers, high-speed burn-in testers, EFEM, cleaning chemicals for DRAM/HBM etch, and PCB lines targeting the AI/HBM test market. Q1 production reached 5.48 million units (1.31M test sockets + 4.17M pogo pins), with raw materials (silicone, powder) totaling KRW 23.85 billion. Product mix: manufactured products 83.4%, merchandise 15.6%, services/other 1.0%.