089030
테크윙
Suppliers
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Techwing
Customers
Competitors
Notes
Techwing is the global leader in memory test handlers with dominant share in DRAM/NAND test handler market. The company has gained significant attention as a beneficiary of the HBM cycle, supplying handlers and COK consumables to major memory makers, with SK Hynix being a particularly important customer. COK parts provide recurring revenue exposure tied to HBM test volumes.
The company filed an amendment to its FY2025 annual report (originally submitted on March 16, 2026) to add previously omitted disclosure of treasury stock direct acquisition and disposal execution history. The newly disclosed item includes a KRW 93,314 million treasury stock disposal on October 20, 2025, which is linked to the 10th unregistered, unguaranteed private exchangeable bond issued on the same date — 1,313,171 treasury shares were treated as exchanged on that date and are currently held in deposit at KSD. Three older disposals (2015, 2018, 2019) totaling KRW ~11.9 billion are also itemized for completeness. The amendment is administrative — no change to financial statements or business operations — but it formalizes the treasury-stock dilution mechanism tied to the EB issuance.
The company will hold a Non-Deal Roadshow (NDR) for institutional investors and analysts in Hong Kong and Singapore from June 29 to July 3, 2026, sponsored by Korea Investment & Securities. The agenda covers progress on existing businesses such as Memory Test Handlers, the HBM-focused Cube Prober inspection equipment business, and new businesses including the DLP Handler. Management will also pitch the company's growth potential and competitiveness in the global semiconductor test equipment market. IR materials will be posted on the company's IR page and KRX KIND on June 29, 2026.