089030
테크윙
Source: dsi_quarterly · analyst_consensus (internal DB). DSI from quarterly filings; consensus as of collection.
Suppliers
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Techwing
Customers
Competitors
Notes
Techwing is the global leader in memory test handlers with dominant share in DRAM/NAND test handler market. The company has gained significant attention as a beneficiary of the HBM cycle, supplying handlers and COK consumables to major memory makers, with SK Hynix being a particularly important customer. COK parts provide recurring revenue exposure tied to HBM test volumes.
The company filed an amendment to its FY2025 annual report (originally submitted on March 16, 2026) to add previously omitted disclosure of treasury stock direct acquisition and disposal execution history. The newly disclosed item includes a KRW 93,314 million treasury stock disposal on October 20, 2025, which is linked to the 10th unregistered, unguaranteed private exchangeable bond issued on the same date — 1,313,171 treasury shares were treated as exchanged on that date and are currently held in deposit at KSD. Three older disposals (2015, 2018, 2019) totaling KRW ~11.9 billion are also itemized for completeness. The amendment is administrative — no change to financial statements or business operations — but it formalizes the treasury-stock dilution mechanism tied to the EB issuance.
The company will hold a Non-Deal Roadshow (NDR) for institutional investors and analysts in Hong Kong and Singapore from June 29 to July 3, 2026, sponsored by Korea Investment & Securities. The agenda covers progress on existing businesses such as Memory Test Handlers, the HBM-focused Cube Prober inspection equipment business, and new businesses including the DLP Handler. Management will also pitch the company's growth potential and competitiveness in the global semiconductor test equipment market. IR materials will be posted on the company's IR page and KRX KIND on June 29, 2026.
Samsung Asset Management filed a simplified large-shareholding report disclosing that its stake fell from 8.11% (3,006,275 shares) to 7.12% (2,636,897 shares), a decrease of 369,378 shares or 0.99 percentage points. The position change is reported for simple investment purposes, not for influencing management, and includes shares delegated to Samsung Active Asset Management. Detailed transactions in early February 2026 show a mix of ETF creations/redemptions and on-market purchases, but the net effect since the prior report on February 5, 2026 was a reduction. As a simplified filing by a professional institutional investor, this is a routine portfolio adjustment rather than a strategic move.
The company will host an IR event on June 4, 2026, from 15:30 to 17:00 in Yeouido, targeting institutional investors and analysts. The session will cover business progress and outlook for the Cube Prober and Memory/SOC Test Handler businesses, along with growth opportunities in the semiconductor inspection market. Sponsored by Samsung Securities, the event will feature a presentation and Q&A format. IR materials will be posted on the company's IR page and KRX KIND system on the event date.
Techwing has signed a supply contract worth ₩9.72 billion (approx. $7.0M USD) to deliver HBM inspection equipment to Samsung Electronics. The contract represents 6.11% of the company's 2025 consolidated annual revenue of approximately ₩159.1 billion. Delivery is scheduled to begin partially on June 1, 2026, with final delivery completed by July 12, 2026. Payment terms are structured as 90% within 30 days of delivery and 10% within 30 days of customer approval, with the contract formally closing by August 13, 2026. The deal underscores continued demand from Samsung for HBM-related testing infrastructure, consistent with prior-year supply relationships.
Techwing filed its Q1 2026 quarterly report (25th fiscal year, Jan 1 – Mar 31, 2026). Product mix shifted meaningfully toward memory test equipment, which rose to 37.0% of revenue from 31.3% in 2025, while non-memory test equipment fell sharply to 1.7% from 5.3%. Parts and peripherals (Interface Boards, COK, upgrades) remain the largest segment at 51.0%. The company highlighted its HBM Cube Prober — a sub-5μm vision-based wafer-level HBM tester — and the TWP300/TWP300H Probe Station as key growth drivers targeting the AI-driven HBM market dominated by SK Hynix, Samsung, and Micron. One non-listed Chinese subsidiary (CK Electronics Technology Nanjing) was liquidated, reducing consolidated subsidiaries from 5 to 4.
The company resolved to sell its land (13,067.3㎡) and building (16,714.38㎡) located in Dongtan Industrial Complex, Hwaseong, Gyeonggi Province, for KRW 59.5 billion. The buyer is Nine Bell Co., Ltd., with no special relationship to the company. The transaction represents 9.39% of total assets (based on 2025 year-end consolidated financials), with closing scheduled for August 31, 2026. The stated purpose is asset efficiency, balance sheet improvement, and securing liquidity. As a voluntary disclosure of a material asset disposal exceeding 5% of total assets, this signals a meaningful cash inflow and potential restructuring of the company's operational footprint.