HBM Inspection Equipment Supply Contract Signed with Samsung Electronics (6.11% of Revenue)
Original: 단일판매ㆍ공급계약체결(자율공시)
Summary
Techwing has signed a supply contract worth ₩9.72 billion (approx. $7.0M USD) to deliver HBM inspection equipment to Samsung Electronics. The contract represents 6.11% of the company's 2025 consolidated annual revenue of approximately ₩159.1 billion. Delivery is scheduled to begin partially on June 1, 2026, with final delivery completed by July 12, 2026. Payment terms are structured as 90% within 30 days of delivery and 10% within 30 days of customer approval, with the contract formally closing by August 13, 2026. The deal underscores continued demand from Samsung for HBM-related testing infrastructure, consistent with prior-year supply relationships.