Annual Report Amendment: Treasury Stock Disposal Disclosure Added (FY2025) — Techwing

Summary

The company filed an amendment to its FY2025 annual report (originally submitted on March 16, 2026) to add previously omitted disclosure of treasury stock direct acquisition and disposal execution history. The newly disclosed item includes a KRW 93,314 million treasury stock disposal on October 20, 2025, which is linked to the 10th unregistered, unguaranteed private exchangeable bond issued on the same date — 1,313,171 treasury shares were treated as exchanged on that date and are currently held in deposit at KSD. Three older disposals (2015, 2018, 2019) totaling KRW ~11.9 billion are also itemized for completeness. The amendment is administrative — no change to financial statements or business operations — but it formalizes the treasury-stock dilution mechanism tied to the EB issuance.

Historical Impact

10 past Correction · ≈ Amendment (/A) events at Techwing

Median +5d

-3.62%

Range

-15.91% to -3.62%

Positive outcomes

0/10

Filed	P₀	P₊₅	+5d
Mar 16, 2026	₩64,100	₩53,900	-15.91%
Jul 21, 2025	₩29,000	₩27,950	-3.62%

Full Translation

Business Report 6.3 Techwing C A Y 134811-0072942 Notice of Correction (Report) June 23, 2026 1. Filing subject to correction: Business Report 2. Original filing date: March 16, 2026 3. Correction item: Item | Related to correction order/request | Reason for correction | Before | After 3. Treasury stock direct acquisition/disposal execution status | No | Not previously disclosed | - | 3. Treasury stock direct acquisition/disposal execution status (Reference date: December 31, 2025) (Unit: KRW million, %) Category | Planned period (start–end) | Planned amount (A) | Executed amount (B) | Execution rate (B/A) | Result report date Direct disposal | 2025-10-20 to 2025-10-20 | 93,314 | 93,314 | 100% | 2025-10-20 Direct disposal | 2019-01-28 to 2019-01-30 | 653 | 653 | 100% | 2019-02-01 Direct disposal | 2018-01-02 to 2018-03-30 | 1,382 | 1,382 | 100% | 2018-02-14 Direct disposal | 2015-05-26 to 2015-05-26 | 9,835 | 9,835 | 100% | 2015-05-26 Note 1) The treasury stock disposal dated October 20, 2025 relates to the Company's 10th unregistered, unguaranteed private placement exchangeable bond issued on the same date. The 1,313,171 treasury shares subject to exchange under these bonds were deemed to have been exchanged on that same date. The actual disposal will be confirmed at the time the exchange right is exercised, and the treasury shares are currently held in deposit at the Korea Securities Depository (KSD). [Confirmation by Representative Director, etc.] (Attached: confirmation letter image) Business Report (24th term) Fiscal year: January 1, 2025 to December 31, 2025 To: Financial Services Commission / Korea Exchange Date: March 16, 2026 Filing entity type: Listed corporation Exemption: None Company name: Techwing Inc. Representative Directors: Na Yoon-seong, Jang Nam Head office: 37 Dongtan-Sandan 6-gil, Dongtan-gu, Hwaseong-si, Gyeonggi-do Phone: 031-379-8000 Website: https://www.techwing.co.kr Responsible drafter: Representative Director Jang Nam, 031-379-8000 I. Company Overview 1. Company Overview - Consolidated subsidiaries: 5 unlisted (no change from beginning to end of period) - New consolidation: TECHWING VINA CO., LTD (renamed) - Removed from consolidation: ENC TECH VINA CO., LTD (renamed) - SME status: Not applicable / Venture: Not applicable / Mid-tier enterprise: Applicable - Listed on KOSDAQ since November 10, 2011 2. Legal and commercial name: Techwing Inc. (Korean: 주식회사 테크윙; English: Techwing, Inc.) 3. Established: July 18, 2002; KOSDAQ listing: November 10, 2011 4. Headquarters and sites: - HQ: 37 Dongtan-Sandan 6-gil, Dongtan-gu, Hwaseong, Gyeonggi-do - Anseong plant: 129 Gieopdanji-ro, Wongok-myeon, Anseong-si, Gyeonggi-do - Asan plant: 118 Asan Valley-ro 387beon-gil, Eumbong-myeon, Asan-si, Chungcheongnam-do - Phones: 031-379-8000 (HQ), 031-678-8000 (Anseong), 041-536-7000 (Asan) 5. Main businesses: The Company manufactures and sells a range of test/inspection equipment, components, and peripherals used in semiconductor testing and inspection. As semiconductor manufacturing technologies advance, performance testing has grown in importance, with longer test times and rising defect rates driving expansion of related inspection processes. The Company offers diverse inspection solutions across the entire semiconductor back-end process. - Flagship product 1: Semiconductor Test Handler (Memory + Non-Memory + Module/SSD) — a core back-end Final Test / Module/SSD inspection machine that transports devices to the tester, controls test temperature, and sorts pass/fail. The Company expanded from Memory to Non-Memory handlers, and continued growth is expected as customers invest in Module/SSD inspection. - Flagship product 2: Burn-In Chamber — reliability test equipment that applies long-duration thermal/voltage stress to weed out weak products. Starting with overseas SSD burn-in supply, the Company plans to expand into DRAM and non-memory burn-in equipment. - Flagship product 3: Wafer inspection equipment — Probe Station. Japanese players such as TEL effectively dominate the market. The Company aims to enter mass-production lines with TWP300 and grow share with the next-gen vision-based TWP300H, contributing to import substitution. - Flagship product 4: HBM Test equipment — Cube Prober. HBM demand is rising rapidly with AI growth; SK hynix, Samsung, and Micron lead the HBM market. Cube Prober enables precise full-unit testing of HBM at the individual level. Using sub-5μm vision precision, it skips loader/unloader/COK steps and transfers wafers directly to the chuck, improving process efficiency vs. competitors. The Company plans to lead the HBM test equipment market based on this product and market advantage. - Flagship product 5: Components and peripherals — including COK (Change Over Kit)... [Translation truncated]