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The AI infrastructure constraint is moving from silicon to power delivery — the power-semi ring is the next primary.
For the first time in 18 months, four layers of the AI cost stack — silicon, memory, substrate, power — pushed back at the same time.
72 hours off the HBM axis: Taiwan commodity DRAM revenue explodes, Japan equipment forecast lifts, the real cause of the US CPU shortage, and Korea's regained pricing power