Subsidiary ASE Semiconductor Manufacturing Acquires Production Equipment from Disco Hi-Tech
Original: 代子公司日月光半導體製造(股)公司公告 取得迪思科高科技股份有限公司供營業用之機器設備
Summary
ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment for business operations from Disco Hi-Tech Co., Ltd. Disco Hi-Tech is the Taiwan entity of DISCO Corporation, a leading Japanese maker of precision dicing, grinding, and polishing equipment widely used in back-end semiconductor packaging — ASE's core business. Full body available on MOPS.
Full Translation
On behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd. (日月光半導體製造股份有限公司), ASE Technology Holding (日月光投控, TWSE: 3711) announces the acquisition of machinery and equipment for business use from Disco Hi-Tech Co., Ltd. (迪思科高科技股份有限公司). Disco Hi-Tech is the Taiwan-registered affiliate of DISCO Corporation (Japan), a premier supplier of precision cutting, grinding, and polishing capital equipment central to semiconductor assembly and test manufacturing processes — consistent with ASE Semiconductor's core advanced packaging and testing operations. This filing constitutes a material information disclosure under TWSE rules governing the acquisition of operating assets by a listed company or its subsidiaries. [Body not available — subject line only. See MOPS for full announcement.]