Subsidiary ASE Semiconductor Acquires Manufacturing Equipment from Disco Hi-Tech
Original: 代子公司日月光半導體製造(股)公司公告 向迪思科高科技股份有限公司取得供營業用之機器設備
Summary
ASE Technology Holding, acting on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., has announced the acquisition of machinery and equipment for operational use from Disco Hi-Tech Co., Ltd. (the Taiwan affiliate of Japan's DISCO Corporation, a leading supplier of precision dicing and grinding tools used in semiconductor packaging). The disclosure indicates the transaction meets TWSE materiality thresholds for equipment purchases, signalling continued capex investment in packaging/assembly capacity. Full body available on MOPS.
Full Translation
ASE Technology Holding Co., Ltd. hereby announces, on behalf of its subsidiary ASE Semiconductor Manufacturing Co., Ltd., the acquisition of machinery and equipment intended for business operations from Disco Hi-Tech Co., Ltd. Disco Hi-Tech (迪思科高科技股份有限公司) is the Taiwan-based entity associated with DISCO Corporation of Japan, a globally recognised manufacturer of precision semiconductor dicing saws, grinders, and polishers widely used in advanced IC packaging processes. Under Taiwan Stock Exchange regulations, equipment purchases exceeding prescribed thresholds must be publicly disclosed as material information; the filing of this announcement confirms the transaction surpasses that threshold. The acquisition supports ASE Semiconductor Manufacturing's ongoing production and capacity requirements. [Body not available — subject line only. See MOPS for full announcement.]