Acquisition of Land Parcel — Details Disclosed
Original: 公告本公司取得土地之相關資訊
Summary
Kinsus Interconnect Technology has announced the acquisition of a land parcel and is disclosing the related details as required under Taiwan's material information rules. For a substrate manufacturer, land purchases typically signal preparation for capacity expansion or new facility construction, making this relevant to investors monitoring the company's capex trajectory. Full body available on MOPS.
Full Translation
Announcement of Information Related to the Company's Acquisition of Land. Kinsus Interconnect Technology (TWSE: 3189) has filed a material information disclosure reporting that it has acquired land, with the announcement covering the relevant details of that transaction — including, typically, the location, area, purchase price, counterparty, and intended use under TWSE/TPEx disclosure requirements. As a leading IC substrate and ABF substrate manufacturer, land acquisitions by Kinsus are generally interpreted as a precursor to facility build-out or production capacity expansion in support of advanced packaging demand. [Body not available — subject line only. See MOPS for full announcement.]