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Semiconductor filings and news across Korea (DART), China, the US (SEC EDGAR), Taiwan (MOPS), and Japan (TDnet) — unified analysis. For informational purposes only — not investment advice.

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© 2026 Silicon Nexus. Data sourced from DART (Korea's EDGAR — operated by the Financial Supervisory Service).

Disclosures

Corporate filings across DART (Korea), TWSE/MOPS (Taiwan), SEC EDGAR (US), TDnet (Japan), and Chinese regulatory filings — AI-translated to English and Korean with impact tagging for portfolio managers.

NVDA· NVIDIA· Aug 17medium
NVIDIA — New Credit Facility and Reg FD Forward Guidance Disclosure
NVIDIA filed an 8-K disclosing a material definitive agreement and corresponding direct financial obligation, most likely a new credit facility or debt issuance (items 1.01 + 2.03 typically travel together for such transactions), accompanied by a Regulation FD disclosure that may contain management commentary or an updated business outlook. Full filing body not analyzed; description inferred from form + item codes. PMs should verify whether the 7.01 item carries new revenue or margin guidance — if so, impact would be elevated given NVIDIA's market sensitivity.
AMD· Advanced Micro Devices· Aug 17medium
095340· ISC· Aug 14low
H1 2026 Semi-Annual Report (26th Fiscal Term, Jan–Jun 2026)
ISC Co., Ltd. filed its 26th-term semi-annual report covering January 1 through June 30, 2026. The company's core business remains the design and manufacture of semiconductor test sockets (silicon rubber contactors) and spring contact probes, with three unchanged consolidated subsidiaries in the US, Vietnam, and Hong Kong. The AA credit rating from iCredible has been maintained consecutively since at least 2020, signaling stable financial health. Total issued shares stand at 21,197,058 with 54,607 treasury shares (0.3%), partly attributable to the 1st and 2nd series exchangeable bonds converted as of April 1, 2026 — details of which appear in the truncated portion of the filing. No changes to the consolidated group or capital structure were reported during the period.
058470· LEENO Industrial· Aug 14low
Semi-Annual Report (H1 2026) — Credit Rating Upgraded to AA+, No Subsidiaries
LEENO Industrial filed its 31st semi-annual report covering the first half of fiscal 2026 (January–June). The most notable development visible in this filing is a credit rating upgrade to AA+ (from AA) by eCredible in April 2026, the first such upgrade in at least two years of tracked ratings. The company remains a standalone entity with no consolidated subsidiaries, and continues its core businesses of manufacturing spring contact probes (LEENO PIN), IC test sockets, and medical device components for ultrasound diagnostics. Financial statements and MD&A sections are included in the full filing but were not provided in the disclosed excerpt, so quantitative performance cannot be assessed from this summary. The company is classified as a mid-sized enterprise (중견기업) listed on KOSDAQ since December 2001.
COHR· Coherent· Aug 14medium
Coherent (COHR) — FY2026 Annual Report (10-K)
095340· ISC· Aug 14low
Subcontractor Payment Methods, Payment Periods, and Dispute Resolution Disclosure (H1 2026)
ISC disclosed its subcontractor payment practices for H1 2026 (January–June) as required under Article 13-3 of the Subcontracting Act. The company made all subcontractor payments entirely in cash or cash equivalents, totaling approximately KRW 36.49 billion, with a cash payment ratio of 100%. The majority of payments (73.89%) were made within 30–60 days, while no payments exceeded the 60-day threshold. The company has not established an internal dispute resolution body for subcontractor disputes.
WDC· Western Digital· Aug 14medium
Western Digital — Annual Report FY2026 (10-K)
ON· ON Semiconductor· Aug 13medium
AMAT· Applied Materials· Aug 13high
CRWV· CoreWeave· Aug 12medium
CoreWeave Q2 2026 Quarterly Results — Revenue, Capex & AI Infrastructure Outlook

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AMD — Material Agreement and New Financial Obligation Disclosed

AMD filed an 8-K reporting a material definitive agreement (Item 1.01) alongside a material direct financial obligation (Item 2.03), a pairing that typically signals a new credit facility, term loan, or debt issuance. PMs should watch for details on size, tenor, and covenants that could affect AMD's leverage profile and capital allocation flexibility. Full filing body not analyzed; description inferred from form + item codes.

Coherent filed its annual 10-K for the fiscal year ended June 30, 2026, covering full-year financial results, segment performance, and forward-looking disclosures across its compound semiconductor, networking, and laser businesses. Key PM focus areas include revenue trajectory in datacom transceivers (800G/1.6T), silicon carbide EV exposure, and progress on the II-VI/Finisar integration synergies. Full filing body not analyzed; description inferred from form + item codes.

Western Digital has filed its annual 10-K report for the fiscal year ended July 3, 2026, covering full-year financial results, business operations, and risk factors. Investors should watch for commentary on NAND and HDD demand trends, AI storage tailwinds, and any balance sheet changes following the Sandisk spin-off. Full filing body not analyzed; description inferred from form + item codes.

ON Semiconductor — Material Event Disclosed via 8-K (Item 8.01)

ON Semiconductor filed an 8-K citing Item 8.01 (Other Material Events), a catch-all category for disclosures that do not fit standard reporting items — commonly used for strategic announcements, restructuring updates, customer agreements, or regulatory developments. Full filing body not analyzed; description inferred from form + item codes. PMs should retrieve the full filing to determine whether this signals a business-model shift, capacity action, or one-off disclosure relevant to ON's power/auto semiconductor positioning.

Applied Materials — Q3 FY2026 Earnings Release

Applied Materials filed an 8-K disclosing its fiscal Q3 2026 results of operations (Item 2.02), accompanied by financial exhibits (Item 9.01). As the world's largest semiconductor equipment maker, AMAT results serve as a leading indicator for WFE (wafer fab equipment) spending trends and are closely watched by PMs holding positions in foundry, memory, and equipment names across US, KR, and TW markets. Full filing body not analyzed; description inferred from form + item codes.

CoreWeave's 10-Q for the quarter ended June 30 2026 discloses full income statement, balance sheet, and cash-flow detail for its GPU cloud business. PMs should watch revenue growth trajectory against the heavy debt-financed capex program, customer concentration (Microsoft and other hyperscaler exposure), and any update to remaining performance obligations or backlog. Full filing body not analyzed; description inferred from form + item codes.