Risk Management Committee Renamed to Risk and Information Security Management Committee
Original: 公告本公司「風險管理委員會」更名為 「風險暨資安管理委員會」
Summary
Winbond Electronics has announced the renaming of its 'Risk Management Committee' to the 'Risk and Information Security Management Committee,' formally expanding the committee's mandate to encompass cybersecurity oversight. The change signals the board's recognition of information security as a distinct governance priority alongside traditional risk management. Full body available on MOPS.
Full Translation
Winbond Electronics (TWSE: 2344) announces that its internal 'Risk Management Committee' (風險管理委員會) has been officially renamed to the 'Risk and Information Security Management Committee' (風險暨資安管理委員會). The addition of '資安' (information security / cybersecurity) to the committee's name indicates a formal expansion of its governance scope to explicitly cover cybersecurity risk, reflecting broader regulatory and market expectations for listed companies in Taiwan to treat information security as a board-level concern. [Body not available — subject line only. See MOPS for full announcement.]