Korea Circuit filed its Q1 2026 quarterly report (55th fiscal year) covering January–March 2026. The company completed a merger with subsidiary Teranix on February 25, 2026, absorbing Teranix's PCB manufacturing operations into the parent; the surviving Teranix entity will pivot to real estate and factory-related services within the Young Poong Group. The consolidated scope covers 6 subsidiaries (2 listed, 4 unlisted), unchanged from the start of the period. Credit rating from E-Credible was upgraded to BBB- in April 2026 from BB+ a year earlier, signaling improved credit quality. Core business remains PCB manufacturing for mobile devices, memory modules, LCDs, and semiconductor packaging substrates, with overseas operations in Vietnam and the US.
Full Translation
Quarterly Report
6.5
Korea Circuit Co., Ltd.
1
Y
130111-0026749
QUARTERLY REPORT (55th Term)
Fiscal Year: January 1, 2026 – March 31, 2026
To: Financial Services Commission, Korea Exchange
Date: May 15, 2026
Filing Entity Type: Listed Company
Exemption Reason: None
Company Name: Korea Circuit Co., Ltd.
CEO: Jang Se-jun
Headquarters: 9, Gangchon-ro 139beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do
Tel: 031-491-3061
Website: https://www.kcg.co.kr
Preparer: Lee Han-gyun, Head of Management Division
TABLE OF CONTENTS
【CEO Certification】 — p.1
I. Company Overview — p.3
1. Company Overview — p.3
2. Corporate History — p.6
3. Changes in Capital Stock — p.8
4. Total Shares — p.8
5. Articles of Incorporation — p.13
II. Business Operations — p.19
1. Business Overview — p.19
2. Key Products and Services — p.20
3. Raw Materials and Production Facilities — p.21
4. Sales and Orders — p.25
5. Risk Management and Derivatives — p.28
6. Major Contracts and R&D — p.34
7. Other Reference Matters — p.37
III. Financial Matters — p.46
1. Summary Financial Information — p.46
2. Consolidated Financial Statements — p.48
3. Notes to Consolidated FS — p.55
4. Separate Financial Statements — p.114
5. Notes to Separate FS — p.119
6. Dividends — p.183
7. Securities Issuance Financing — p.187
8. Other Financial Matters — p.188
IV. Management Discussion and Analysis — p.195
V. External Auditor's Opinion — p.196
VI. Board and Corporate Governance — p.200
VII. Shareholders — p.211
VIII. Officers and Employees — p.216
IX. Affiliated Companies — p.222
X. Transactions with Major Shareholders — p.223
XI. Other Matters for Investor Protection — p.224
XII. Detailed Tables — p.235
【Expert Confirmation】 — p.240
I. COMPANY OVERVIEW
1. Company Overview
A. Consolidated Subsidiaries Summary (in companies):
Listed: 2 (start) → 2 (end), no changes
Unlisted: 4 (start) → 4 (end), no changes
Total: 6 consolidated subsidiaries, 4 major subsidiaries
See 'Detailed Table 1 — Consolidated Subsidiaries' for details
B. Changes in Consolidation Scope: None (no new consolidations, no removals)
C. Legal and Commercial Name:
Korean: 주식회사 코리아써키트
English: KOREA CIRCUIT CO., LTD.
D. Founding Date and Duration:
Founded April 11, 1972, with PCB (Printed Circuit Board) manufacturing and sales as primary business.
E. Headquarters Address, Phone, Website:
Address: 9, Gangchon-ro 139beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do (Seonggok-dong)
Tel: 031-491-3061
Website: https://www.kcg.co.kr
F. SME / Venture / Mid-sized Enterprise Classification: None of the above.
G. Main Business and Future Plans:
The parent company is a specialized PCB manufacturer producing PCBs for mobile communication devices, memory modules, LCDs, and semiconductor packaging substrates, sold to domestic and overseas electronics manufacturers. Subsidiary Teranix Co., Ltd., a specialty PCB (LED PCB, etc.) manufacturer, was merged into Korea Circuit effective February 25, 2026, with its PCB manufacturing operations absorbed by the parent.
Going forward, the surviving Teranix entity will use its retained resources to pursue businesses related to the Young Poong Group's electronics affiliates, including real estate management, factory design and renovation, new factory acquisition and disposal, and overseas factory construction.
Subsidiary Interflex Co., Ltd. specializes in flexible printed circuit boards (FPCBs). Subsidiary Signetics Co., Ltd. operates in semiconductor packaging manufacturing. Overseas, KOREA CIRCUIT VINA COMPANY LIMITED and INTERFLEX VINA CO., LTD. operate PCB manufacturing in Vietnam, and SIGNETICS HIGH TECHNOLOGY USA INC handles overseas semiconductor packaging sales. See Section II for details.
H. Credit Rating Information:
2026-04-16: DNA PLUS Report, BBB-, E-Credible
2025-04-21: DNA PLUS Report, BB+, E-Credible
2024-05-09: DNA PLUS Report, BBB+, E-Credible
Note: The company has not issued corporate bonds during the disclosure period...
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Past performance does not guarantee future results. Small sample sizes may not be representative. For informational purposes only.