Q1 2026 Quarterly Report: 26th Fiscal Period

Quarterly Report (26th Fiscal Period) Fiscal year: January 1, 2026 to March 31, 2026 Submitted to: Financial Services Commission, Korea Exchange Submission date: May 14, 2026 Filing entity type: Listed company with voting shares Exemption reason: Not applicable Company name: Hana Micron Co., Ltd. CEO: Lee Dong-chul Head office location: 77 Yeonam-yulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do Phone: 041-423-7777 Website: http://www.hanamicron.com Responsible preparer: Park Sang-mook, Executive Director Phone: 041-423-7777 Table of Contents [Confirmation by CEO, etc.] CEO confirmation signature (2026.05.14).jpg I. Company Overview 1. Company Overview a. Status of consolidated subsidiaries (applies only when a listed company preparing consolidated financial statements submits business, quarterly, or semi-annual reports) Summary of consolidated subsidiaries (unit: companies) - Listed: opening 1, increase 0, decrease 0, ending 1, major subsidiaries 1 - Unlisted: opening 13, increase 0, decrease 2, ending 11, major subsidiaries 2 - Total: opening 14, increase 0, decrease 2, ending 12, major subsidiaries 3 ※ See 'Detailed Table-1. Status of consolidated subsidiaries (Detail)' for details. b. Changes in consolidated companies - New consolidations: None - Removed from consolidation: Innomate Co., Ltd. (bankrupt during the quarter); AniTrace, Inc. (liquidated during the quarter) Note 1) Innomate was adjudged bankrupt by court order on January 29, 2026. Note 2) AniTrace was liquidated during the quarter. c. Company name / commercial name The company's name is Hana Micron Co., Ltd., with the English name HANA Micron, Inc. d. Date of establishment Established on August 23, 2001, and conducted its IPO on October 11, 2005. e. Head office address, phone, website - Address: 77 Yeonam-yulgeum-ro, Eumbong-myeon, Asan-si, Chungnam - Phone: 041-423-7777 - Website: http://www.hanamicron.com f. Whether the company qualifies as a small/medium enterprise, etc. As of the report submission date, the company does not qualify as an SME under Article 2 of the Framework Act on Small and Medium Enterprises, but qualifies as a mid-sized enterprise under Article 2(1) of the Special Act on the Promotion of Growth and Strengthening of Competitiveness of Mid-sized Enterprises. - SME status: Not applicable - Venture company status: Not applicable - Mid-sized enterprise status: Applicable g. Main business activities - Hana Micron Co., Ltd.; HT MICRON SEMICONDUTORES S.A.; Hana Micron Vina Co., Ltd: Semiconductor packaging, testing, modules - Hana Materials Co., Ltd.: Manufacture and sale of silicon parts ※ For further details, refer to 'II. Business Description' in this report. h. Credit rating - Evaluation date: May 6, 2026 - Subject: Corporate bonds - Credit rating: BBB - Rating agency: Korea Investors Service (range: AAA to D) - Type: Regular evaluation ※ Credit rating system description: - AAA: Highest level of certainty of principal and interest payment; stable enough to be unaffected by foreseeable environmental changes. - AA: Very high certainty of payment; low possibility of being affected by foreseeable environmental changes. - A: High certainty of payment, but more susceptible to future environmental changes than higher grades. - BBB: Certainty of payment exists, but potential for deterioration depending on future environmental changes. - BB: Minimum certainty of payment, but stability is variable and highly speculative. - B: Insufficient certainty of payment; stability is variable and highly speculative. - CCC: High likelihood of default. - CC: Very high likelihood of default. - C: Extremely high likelihood of default; default is unavoidable within reasonable forecasts. - D: Currently in default. Note 1) For grades from AA to B, a + or - sign may be assigned based on relative position within the grade. i. Stock listing (or registration/designation) and special listing - Listing: KOSDAQ - Listing date: October 11, 2005 - Special listing type: Not applicable 2. Company History a. Head office location and changes The head office is currently located at 77 Yeonam-yulgeum-ro, Eumbong-myeon, Asan-si, Chungnam. The head office was relocated from 10-9 Sodong-ri, Eumbong-myeon, Asan-si, Chungnam to the current address on April 10, 2006, due to relocation of the main business site. b. Major changes in management and auditors As of the report submission date, the board operates under CEO Lee Dong-chul. Major management changes during the disclosure period are as follows: - March 30, 2022 (Regular AGM): Re-appointed - inside director Lee Dong-chul - March 30, 2023 (Regular AGM): New - outside director Jung Seung-bu; Re-appointed - inside director Kim Gil-baek; Term ended/dismissed - outside director Jang Ho-jung - March 28, 2024 (Regular AGM): New - inside director Kim Dong-hyun; Re-appointed - inside director Park Sang-mook, auditor Ahn Jae-geun; Term ended/dismissed - inside director Kim Gil-baek - March 28, 2025 (Regular AGM): Re-appointed - inside director Lee Dong-chul - March 26, 2026 (Regular AGM): New - outside director Yoon Seung-han; Term ended/dismissed - outside director Jung Seung-bu c. Changes in largest shareholder The largest shareholder is Choi Chang-ho, with no changes since the company's establishment. d. Changes in trade name The company has not changed its trade name since establishment. Trade name changes of major subsidiary Hana Materials Co., Ltd. are as follows: - 2008.08.12: Hana Silicon Tech Co., Ltd. → Hana Silicon Co., Ltd. - 2013.04.19: Hana Silicon Co., Ltd. → Hana Materials Co., Ltd. e. History of composition, corporate reorganization procedures, or similar proceedings ※ Not applicable. f. Mergers, etc. ※ Not applicable. g. Changes in industry or main business ※ Not applicable. h. Other significant matters related to management activities - 2020.01: Capital increase from exercise of 7th CB (KRW 0.11 billion) - 2020.01: Patent - Fingerprint sensor package and fingerprint sensor module including same - 2020.02: Completion of Vietnam subsidiary (Hana Micron Vina) plant construction - 2020.02: Patent - Semiconductor device with redistribution structure and wafer-level package and manufacturing method - 2020.03: Capital increase from exercise of 8th CB (KRW 6.14 billion) - 2020.03: Capital increase from stock option exercise - 2020.04: Capital increase from exercise of 8th CB (KRW 4.11 billion) - 2020.09: Capital increase from exercise of 8th CB (KRW 0.25 billion) and stock options - 2020.09: Patent - Gas sensor package, wafer-level gas sensor package and manufacturing method - 2020.10: Capital increase from stock option exercise - 2020.11: Capital increase from stock option exercise - 2020.11: Decision to physically spin off the BUMP business division - 2020.12: Capital increase from stock option exercise - 2021.01: Completion of BUMP business division physical spin-off; establishment of spin-off entity (Hana WLS Co., Ltd.) - 2021.01: Capital increase from stock option exercise - 2021.02: Capital increase from exercise of 8th CB (KRW 4.5 billion) and stock options - 2021.03: Capital increase from stock option exercise - 2021.04: Capital increase from stock option exercise - 2021.06: Establishment of Brazil subsidiary (Hana Electronics Industria E Comercio Ltda) - 2021.11: Signed mid-to-long-term semiconductor back-end business cooperation and outsourced processing agreement with SK Hynix Inc. - 2021.12: Conducted rights offering with general public subscription for forfeited shares and bonus issue - 2022.03: Established System Semiconductor Test Support Center - 2022.11: Selected for KOSDAQ Global Segment (Korea Exchange) - 2022.12: Received Export Tower Award (USD 400 million) - 2023.03: Issued 12th bearer perpetual convertible bonds (private placement, unguaranteed) - 2023.09: Selected as Republic of Korea's Best Employment Company [Translation truncated]