Cash Dividend Payment Set for July 10, 2026; Typhoon Delay Contingency Disclosed
Original: 公告本公司訂於115年07月10日發放現金股利，如因颱風 影響部分地區之現金股利發放將順延至下一個營業日。
Summary
WIN Semiconductors announces that previously declared cash dividends will be distributed to shareholders on July 10, 2026 (ROC Year 115). The company has included a contingency clause stating that if typhoon conditions disrupt distribution in any region, the affected payments will be deferred to the next business day. This is an administrative payment-logistics notice, not a new dividend declaration; full body available on MOPS.
Full Translation
The company hereby announces that cash dividends are scheduled to be paid out on July 10, Year 115 of the Republic of China (July 10, 2026). Should typhoon conditions cause disruption to cash dividend distribution in certain areas, the distribution for those affected areas will be postponed to the following business day. Context: Taiwan's securities regulator requires listed companies to publicly disclose the scheduled dividend payment date and any force-majeure deferral provisions; this filing fulfills that obligation and does not constitute a new dividend resolution. [Body not available — subject line only. See MOPS for full announcement.]