Amended Securities Registration Statement (Equity)

Securities Registration Statement (Equity) 6.1 LB Semicon Co., Ltd. Amendment Filing (Report) June 1, 2026 1. Document subject to amendment: Securities Registration Statement (Equity) 2. Initial submission date of document subject to amendment: May 15, 2026 [Registration Statement Submission and Amendment History] Date | Document | Note May 15, 2026 | Securities Registration Statement (Equity) | Initial submission June 1, 2026 | [Amendment] Securities Registration Statement (Equity) | 1st amendment (bold blue) 3. Items amended Item | Related to amendment order/demand | Reason | Before | After * The current amendments are corrections supplementing the disclosure content. For ease of identifying amendments, revised items are marked in 'bold blue.' * The summary information reflects the body amendments; no separate errata is provided. * Simple typographical errors have been corrected without color marking. Part 1 — Matters concerning offering or sale III. Investment Risk Factors 1. Business Risks b. Risk from downstream industry cyclicality — No / Voluntary amendment — (Note 1) Before / (Note 1) After e. Risk from major customer concentration — (Note 2) h. Risk from rising raw material prices — (Note 3) j. Risk of weakened technological competitiveness from R&D talent outflow — (Note 4) k. Intellectual property-related risks — (Note 5) 2. Company Risks a. Revenue and profitability deterioration risk — No / Voluntary amendment — (Note 6) b. Financial stability-related risks — (Note 7) c. Cash flow deterioration risk — (Note 8) f. Tangible asset-related risks — (Note 9) i. Changes in controlling shareholder stake and management control stability from old-share sale and subscription — (Note 10) 3. Other Risks a. Risk from tightening of financial supervisory authority oversight standards — No / Voluntary amendment — (Note 11) IV. Underwriter's opinion (analyst evaluation) — (Note 12) V. Use of proceeds — (Note 13) Part 2 — Matters concerning the issuer VII. Directors, employees, and related matters — (Note 14) (Note 1) Before (abbreviated lead-in) [2026 Semiconductor Distribution by Type] Product category | Class | 2026 size | Share | YoY growth | Key applications Logic | Non-memory | $390.9B | 40.1% | +32.1% | AI chips, ASIC, GPU Memory | Memory | $294.8B | 30.2% | +39.4% | Data centers, PC, mobile Microprocessor | Non-memory | $96.6B | 9.9% | +7.9% | PC, server, IoT Analog | Non-memory | $92.0B | 9.4% | +7.5% | Industrial / telecom infrastructure Optoelectronics | Non-memory | $45.0B | 4.6% | +4.0% | Display, optical communication Discrete | Non-memory | $33.4B | 3.4% | Slight decline | Power / automotive Sensor | Non-memory | $22.7B | 2.3% | +10.4% | Wearables, vehicles Total | – | $975.4B | 100.0% | – | – Source: WSTS (World Semiconductor Trade Statistics) Since 2024, the memory semiconductor market has seen rising demand for server DRAM and high-bandwidth memory (HBM) driven by large-scale data processing for AI training and inference. Alongside growth in data center and cloud computing markets, demand for high-performance, high-capacity memory in AI servers and HPC environments is increasing, and a market recovery is emerging. In addition, with rising memory usage across mobile devices, IoT, and automotive electrification, the demand base of the memory semiconductor market is expected to continue expanding. However, as consumption of high-spec mobile products such as tablets increases, PC production is gradually declining, and the smartphone market has reached saturation and entered a mature phase, which presents persistent negative factors against continuous growth of the memory market. Additionally, since most IT product consumption has seasonal variation by country and region, shipment volumes may decline sharply in particular periods. Large-capacity servers and cloud software, recently spotlighted as next-generation growth engines, are also highly sensitive to the capex plans of the related operators (IDCs, Internet Data Centers). If Samsung Electronics or SK Hynix recalibrate their capex and new investment plans, the Company's performance and operating environment could be negatively affected, and investors should be mindful of this. (omitted) (Note 1) After (abbreviated lead-in) [2026 Semiconductor Distribution by Type] — same table as above Since 2024, the memory semiconductor market has seen rising demand for server DRAM and HBM driven by AI training and inference data processing. With growth in data center and cloud computing markets, demand for high-performance, high-capacity memory in AI servers and HPC environments is increasing, fueling a market recovery. With memory usage rising across mobile devices, IoT, and automotive electrification, the demand base is expected to continue expanding. As noted above, WSTS forecasts the global semiconductor market in 2026 will grow more than 25% YoY to approximately $975 billion. The key driver of this growth is the explosive spread of Generative AI; HBM's share within the DRAM market continues to expand, rising to more than 30% of total DRAM revenue in 2025 as a core item. AI compute demand grew approximately 40–60% annually in cloud environments during 2024–2025, and the global AI semiconductor market expanded from roughly $18.5B in 2020 to about $43.9B in 2024 — more than doubling — reflecting a structural transition that differs from past semiconductor demand cycles. However, this surge in AI semiconductor demand is not affecting the broader semiconductor market evenly. Non-AI semiconductor growth is projected to decline in 2026, and the OSAT sector shows a bifurcated structure: traditional packaging and test businesses are sluggish while advanced packaging orders surge from AI accelerator demand. The display-related non-memory backend market, including DDI and COF, sits outside the direct beneficiary range of the AI super-cycle; existing structural weakness continues, driven by Chinese panel makers' shift to domestic DDI and stagnant consumer electronics demand. The Company's DDI bumping and COF packaging businesses compete within this traditional backend market and thus see limited direct benefit from the AI demand surge, whereas the Non-DDI bumping/test business (SoC, PMIC, CIS) being pursued as a new growth area has the potential to capture expanding backend outsourcing of AI and automotive system semiconductors from global fabless customers. Meanwhile, the current AI semiconductor demand surge raises overheating (Overheat… [Translation truncated]