TER
테라다인
Source: dsi_quarterly · analyst_consensus (internal DB). DSI from quarterly filings; consensus as of collection.
Suppliers
—
Teradyne
Customers
Competitors
Notes
Teradyne is the #2 global ATE vendor behind Advantest, with particular strength in SoC test (Apple processors via TSMC OSAT partners) and increasing exposure to HBM/memory test. AI compute and HBM growth are key tailwinds, though it has lost share to Advantest in mobile SoC test in recent years. Robotics segment (UR/MiR) provides diversification but has underperformed expectations.
Teradyne filed an 8-K disclosing a material definitive agreement (Item 1.01) alongside a material direct financial obligation (Item 2.03), a pairing that typically indicates the company has entered into a new credit facility, term loan, or similar debt arrangement. Full filing body not analyzed; description inferred from form + item codes. PMs should monitor the size, tenor, and covenant terms of any new debt, as it affects Teradyne's balance sheet flexibility heading into a capex-heavy semiconductor test equipment cycle.
Teradyne filed its 10-Q for the quarter ended June 28, 2026, covering financial results, segment performance, and management commentary. PMs should watch for updates on semiconductor test equipment demand, particularly any signals from AI/HBM-driven tester cycles and automotive/industrial recovery. Full filing body not analyzed; description inferred from form + item codes.
Teradyne filed an 8-K disclosing its Q2 2026 financial results (Item 2.02), likely including revenue, earnings, and forward guidance for the test-equipment maker whose ATE cycle is a leading indicator for HBM, advanced logic, and smartphone SoC demand. Item 9.01 covers the accompanying press-release exhibit. Full filing body not analyzed; description inferred from form + item codes. PMs should watch for commentary on AI-driven tester demand and any revision to full-year outlook.
Routine 8-K under Item 5.07 reporting outcomes of shareholder votes (director elections, auditor ratification, say-on-pay) at the annual meeting. Full filing body not analyzed; description inferred from form + item codes. Typically non-market-moving unless a contested vote or material governance pushback surfaces.
Quarterly report covering the period ended 2026-03-29, expected to detail semiconductor test and robotics segment revenue, gross margin trends, and updated outlook commentary tied to AI/HBM and SoC test demand. Full filing body not analyzed; description inferred from form + item codes. PMs should watch ATE bookings, China exposure, and any commentary on memory test capex feeding into the KR/TW HBM cycle.
Filing pairs Item 2.02 (results of operations) with Item 9.01 exhibits, indicating Teradyne released quarterly earnings on Apr 28, 2026. PMs should watch SoC/memory ATE demand commentary, HBM tester traction, and any FY guide revision given the AI-driven test capex cycle. Full filing body not analyzed; description inferred from form + item codes.
Full filing body not analyzed; description inferred from form + item codes. Annual 10-K for FY2025 will detail Semiconductor Test segment trends (HBM/AI compute test demand from Korean/Taiwanese memory and foundry customers), Robotics performance, FY2026 capex/guidance signals, and risk factors around China exposure and export controls. PMs should focus on segment backlog commentary, customer concentration (TSMC, Samsung, SK hynix) and any HBM4 test capacity outlook.
Filing under Item 2.02 (Results of Operations) with Item 9.01 exhibits, indicating Teradyne released quarterly earnings, almost certainly Q4/FY2025 results given the early-February timing. PMs should watch SoC and memory test demand commentary, HBM/AI test tool exposure, and any FY2026 outlook that frames capex by Samsung/SK hynix and TSMC. Full filing body not analyzed; description inferred from form + item codes.