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Semiconductor filings and news across Korea (DART), China, the US (SEC EDGAR), Taiwan (MOPS), and Japan (TDnet) — unified analysis. For informational purposes only — not investment advice.

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© 2026 Silicon Nexus. Data sourced from DART (Korea's EDGAR — operated by the Financial Supervisory Service).

Micron Technology (MU) | Silicon Nexus

MU

Micron Technology

마이크론

Price

Supply Chain Position

Memory

Designs and manufactures DRAM, HBM, and NAND flash memory as one of three global memory IDMs, with fabs in the US, Taiwan, Japan, and Singapore.

Suppliers

ASML
Applied Materials
Lam Research
Tokyo Electron
KLA

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Micron Technology

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Customers

NVIDIA
Apple
Dell Technologies
HP Inc.
Microsoft

Competitors

Samsung ElectronicsSK Hynix

Recent Disclosures (10)

Jun 25, 2026medium
Micron — Q3 FY26 10-Q (HBM, DRAM/NAND Margins in Focus)
Full filing body not analyzed; description inferred from form + item codes. Quarterly report covering the period ended 2026-05-28 — PMs should focus on HBM3E/HBM4 revenue ramp, DRAM/NAND pricing and gross margin trajectory, datacenter vs. consumer mix, and any updated capex/inventory commentary tied to AI demand.

Kioxia

Western Digital

YMTC

Notes

Third-largest DRAM maker globally behind Samsung and SK Hynix, and a key NAND player. Qualified HBM3E for NVIDIA's H200/B100 platforms in 2024, positioning Micron as the #3 HBM supplier alongside SK Hynix and Samsung. Receiving up to $6.1B in US CHIPS Act funding to build leading-edge DRAM fabs in New York and Idaho.

See Micron Technology in the full network map

Jun 24, 2026high

Micron — FY26 Q3 Earnings Release

Micron filed an 8-K disclosing quarterly results of operations (Item 2.02) with supporting exhibits (Item 9.01), almost certainly the FY26 Q3 earnings release covering revenue, margins, segment mix (DRAM/NAND, HBM), and forward guidance. PMs should focus on HBM ramp commentary, data-center DRAM pricing, and capex/guidance versus Street as a key read-across for SK Hynix, Samsung, and the broader memory cycle. Full filing body not analyzed; description inferred from form + item codes.

Micron — Officer/Director Change Disclosed

Item 5.02 indicates an officer or director change at Micron, with Item 9.01 attaching supporting exhibits (likely a press release or separation/appointment agreement). Full filing body not analyzed; description inferred from form + item codes. PM relevance depends on whether the change involves CEO/CFO or a routine board seat — default treatment is low absent confirmation of a top-executive transition.

Dec 17, 2025high

Micron — Q1 FY26 Earnings Release

Item 2.02 indicates Micron issued its quarterly earnings release, with Item 9.01 attaching the press release as an exhibit. PMs should focus on revenue, DRAM/NAND ASP trends, HBM contribution, gross margin, and forward guidance — all critical read-throughs for Samsung, SK Hynix, and the broader Asia memory complex. Full filing body not analyzed; description inferred from form + item codes.

Dec 18, 2025medium

Micron — Q1 FY26 10-Q Quarterly Report

Micron filed its quarterly 10-Q covering the period ended 2025-11-27, which will disclose Q1 FY26 revenue, margins, segment splits (DRAM/NAND, HBM, data center vs. mobile), inventory, capex, and forward commentary. Key PM watch items: HBM3E/HBM4 ramp progress, DRAM/NAND ASP trajectory, data-center mix, and inventory days given the late-cycle memory tape. Full filing body not analyzed; description inferred from form + item codes.

Jan 21, 2026low

Micron — Bylaw Amendments and Annual Meeting Vote Results

Filing likely discloses amendments to Micron's bylaws/articles alongside results from the annual shareholder meeting (director elections, say-on-pay, auditor ratification), with supporting exhibits. Routine governance disclosure with limited near-term P&L or thesis impact for semi PMs. Full filing body not analyzed; description inferred from form + item codes.

Mar 18, 2026high

Micron — Q2 FY26 Earnings Release

Filing covers Item 2.02 (earnings release) with Item 9.01 exhibits, indicating Micron posted quarterly results and supporting press materials. PMs should review revenue, DRAM/NAND ASPs and bit shipments, HBM traction, gross margin trajectory, and forward guidance for read-through to Samsung/SK Hynix and broader memory cycle positioning. Full filing body not analyzed; description inferred from form + item codes.

Mar 19, 2026medium

Micron — Q2 FY26 10-Q Quarterly Report

Micron filed its fiscal Q2 10-Q for the period ended 2026-02-26, which should disclose DRAM/NAND revenue mix, gross margin trajectory, HBM ramp commentary, capex guidance, and inventory/DSI dynamics. PMs will scrutinize HBM3E/HBM4 progress, hyperscaler demand color, and pricing power versus Samsung and SK Hynix. Full filing body not analyzed; description inferred from form + item codes.

Mar 25, 2026medium

Micron — Other Material Event Disclosed With Supporting Exhibits

Filing flags an unspecified material event under Item 8.01 (Other Events) with Item 9.01 exhibits attached, which Micron typically uses for press releases, debt/notes offerings, capital actions, or non-earnings business updates. Full filing body not analyzed; description inferred from form + item codes — PMs should pull the exhibit to confirm whether this is a financing action, guidance update, or operational announcement before sizing impact on the memory cycle thesis.

Apr 1, 2026medium

Micron — Other Material Event Disclosed (8-K Item 8.01)

Micron filed an 8-K under Item 8.01 (Other Material Events) with supporting exhibits (Item 9.01). Item 8.01 is a catch-all for voluntary disclosures and can range from trivial press releases to material business updates, so PMs should pull the body to confirm whether it touches HBM supply agreements, capex, China exposure, or capital actions. Full filing body not analyzed; description inferred from form + item codes.