AMKR
앰코
Source: dsi_quarterly · analyst_consensus (internal DB). DSI from quarterly filings; consensus as of collection.
Suppliers
Amkor Technology
Customers
Competitors
Notes
Second-largest OSAT globally behind ASE, with strong positions in advanced SiP packaging for mobile and automotive. Building a $2B advanced packaging facility in Arizona with TSMC partnership and CHIPS Act funding to serve US-based fabs. Heavy customer concentration risk with Apple representing a large share of revenue.
Amkor's 10-Q for the quarter ended June 30, 2026 covers revenue, gross margin, and capex trends across its OSAT (outsourced semiconductor assembly and test) business, with key exposure to advanced packaging demand from mobile, automotive, and AI chip customers. Full filing body not analyzed; description inferred from form + item codes. PMs should watch for utilization commentary, advanced packaging mix shift, and any capex guidance revision relevant to AMKR's Korea/Vietnam/Japan fab footprint.
Amkor Technology filed an 8-K under Item 2.02 disclosing its quarterly results of operations, indicating an earnings release. As a leading OSAT (outsourced semiconductor assembly and test) provider, AMKR results are a high-signal read on advanced packaging demand, AI/HBM ramp, and customer utilization trends across TSMC, Samsung, and fabless clients. Full filing body not analyzed; description inferred from form + item codes.
Filing under Item 7.01 suggests Amkor shared forward-looking commentary or guidance with investors (e.g., conference, investor day, or mid-quarter update), with Item 9.01 attaching supporting exhibits. Material for PMs tracking OSAT demand signals across AI compute, smartphone, and automotive end-markets, and as a read-through for TSMC/ASE peers. Full filing body not analyzed; description inferred from form + item codes.
Amkor filed an 8-K under Item 5.07 reporting the outcome of shareholder votes from its annual meeting, typically covering director elections, auditor ratification, and routine governance proposals. Full filing body not analyzed; description inferred from form + item codes. Low PM relevance absent an unusual say-on-pay rejection or contested board outcome.
Filing combines a material definitive agreement (1.01), a new direct financial obligation (2.03), and an unregistered sale of equity (3.02), with supporting exhibits (9.01) — likely a financing package (e.g., credit facility or note issuance) paired with private equity placement. PMs should watch for leverage/dilution impact, capex linkage (Arizona OSAT buildout), and counterparty/lender identity. Full filing body not analyzed; description inferred from form + item codes.
Amkor filed an 8-K under Item 8.01 (Other Material Events) with supporting exhibits under 9.01. Item 8.01 is a catch-all for voluntary disclosures, ranging from routine press releases to material business updates; without the body, the specific trigger is unclear. Full filing body not analyzed; description inferred from form + item codes — PMs should open the filing to confirm whether it touches OSAT capacity, Arizona fab progress, customer wins, or capital actions.
Filing under Item 8.01 signals an unscheduled material event Amkor opted to disclose voluntarily, with Item 9.01 attaching supporting exhibits (often a press release or agreement copy). Without the body, the trigger is ambiguous — plausible candidates include a customer/capacity announcement, capital action, or litigation update relevant to OSAT pricing and TSMC/Apple advanced-packaging dynamics. Full filing body not analyzed; description inferred from form + item codes.
Amkor's 10-Q for the quarter ended 2026-03-31 should detail OSAT revenue, utilization, and advanced packaging mix (notably 2.5D/CoWoS-class and SiP demand tied to AI accelerators and premium mobile). Full filing body not analyzed; description inferred from form + item codes. PMs should watch capex guidance, Vietnam ramp commentary, and segment splits (Communications vs. Computing) as read-throughs for TSMC back-end loading and Korean memory packaging peers.
Filing flags Item 2.02 (Results of Operations) with supporting 9.01 exhibits, indicating Amkor released quarterly earnings on 2026-04-27. PMs should focus on advanced packaging revenue mix (2.5D/CoWoS-S alternatives, HBM-adjacent capacity) and any FY26 guidance shifts tied to AI/HPC demand and TSMC overflow work. Full filing body not analyzed; description inferred from form + item codes.
Full filing body not analyzed; description inferred from form + item codes. Amkor's 10-K covers FY2025 results, segment mix (advanced vs. mainstream packaging), capex on the Arizona OSAT fab, and customer-concentration risk — PMs should mine it for HBM/CoWoS-S exposure, AI/HPC packaging revenue trajectory, and FY2026 capex guidance relevant to TSMC/Samsung packaging supply chains.
Filing under Item 8.01 signals a non-routine corporate development Amkor deemed material outside standard 8-K triggers, with supporting exhibits attached under Item 9.01. Full filing body not analyzed; description inferred from form + item codes. PMs should review the underlying exhibit to gauge relevance to OSAT capacity, customer wins, or financing actions ahead of the next print.
Filing pairs Item 2.02 (earnings release) with Item 9.01 exhibits, indicating Amkor reported quarterly results — key read-through for OSAT demand, advanced packaging mix (2.5D/CoWoS-S adjacent), and capex guidance tied to AI accelerator and HBM-bearing logic ramps at TSMC/Samsung customers. PMs should watch revenue split by end market (communications/computing/automotive), gross margin trajectory, and Vietnam/Arizona capex commentary. Full filing body not analyzed; description inferred from form + item codes.
Amkor filed an 8-K under Item 5.02 reporting a change in officers or directors, which could range from a routine board appointment to a material CEO/CFO departure. Full filing body not analyzed; description inferred from form + item codes — PMs should verify whether the change involves a top executive (CEO/CFO) before adjusting positioning, as OSAT leadership continuity matters for Amkor's TSMC/advanced-packaging execution.