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LEENO Industrial (058470) | Silicon Nexus

058470

LEENO Industrial

리노공업

Price

Supply Chain Position

Equipment (WFE/Test/Inspection)

Makes IC test probes (Leeno Pins) and probe cards used to test semiconductor devices during back-end test and burn-in.

Suppliers

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LEENO Industrial

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Customers

Samsung Electronics
SK Hynix
Qualcomm

Competitors

FormFactorTechnoprobeMJC (Micronics Japan)

Recent Disclosures (4)

Aug 14, 2026low
Semi-Annual Report (H1 2026) — Credit Rating Upgraded to AA+, No Subsidiaries
LEENO Industrial filed its 31st semi-annual report covering the first half of fiscal 2026 (January–June). The most notable development visible in this filing is a credit rating upgrade to AA+ (from AA) by eCredible in April 2026, the first such upgrade in at least two years of tracked ratings. The company remains a standalone entity with no consolidated subsidiaries, and continues its core businesses of manufacturing spring contact probes (LEENO PIN), IC test sockets, and medical device components for ultrasound diagnostics. Financial statements and MD&A sections are included in the full filing but were not provided in the disclosed excerpt, so quantitative performance cannot be assessed from this summary. The company is classified as a mid-sized enterprise (중견기업) listed on KOSDAQ since December 2001.

Yokowo

Notes

Leeno Industrial is the global leader in pogo-pin style test probes used in semiconductor final test and burn-in, with high market share in non-memory test sockets. Demand is leveraged to advanced packaging and HBM/AI chip test intensity, though high customer concentration in Korean memory makers and Apple/Qualcomm-linked fabless chips is a key risk.

See LEENO Industrial in the full network map

Jul 29, 2026medium

J.P. Morgan Securities PLC Reduces Stake Below 5% Threshold (5.11% → 4.03%)

J.P. Morgan Securities PLC, along with two affiliated entities (J.P. Morgan Securities LLC and J.P. Morgan Prime Inc.), filed a simplified large-shareholding change report disclosing a reduction in its combined stake in LEENO Industrial. The aggregate holding fell from 3,896,206 shares (5.11%) to 3,073,540 shares (4.03%), a decrease of 822,666 shares (-1.08 percentage points), crossing below the 5% reporting threshold. The change was attributed to on-market trading, changes in the count of specially-related parties, and stock borrowing/return transactions. The stated investment purpose remains purely financial (단순투자), with no intent to influence management. The obligation date for this report was July 13, 2026, with the report filed as of July 23, 2026.

May 14, 2026low

Q1 2026 Quarterly Report (31st Fiscal Year)

LEENO Industrial filed its Q1 2026 quarterly report covering January 1 to March 31, 2026. Total revenue mix shows IC Test Sockets contributing 64.10% of sales (KRW 63.9 billion, with KRW 59.6 billion from exports and KRW 4.3 billion domestic), while LEENO PINs accounted for 24.65% (KRW 24.6 billion, KRW 18.8 billion exports and KRW 5.8 billion domestic). The company continues to leverage its 40+ years of expertise in semiconductor test consumables and is expanding into medical device components for ultrasound diagnostic equipment. Standard items like company overview, history, capital changes, and share details are omitted per quarterly reporting rules and will appear in semi-annual/annual reports. Strong export-driven revenue concentration in semiconductor test sockets indicates continued tailwind from global memory and non-memory chip testing demand.

May 6, 2026high

Q1 2026 Preliminary Results: Revenue +27.2% YoY, Operating Profit +35.4% YoY

LEENO Industrial reported strong preliminary Q1 2026 results, with revenue of KRW 99.77 billion, up 27.2% year-over-year and 17.7% quarter-over-quarter. Operating profit jumped 35.4% YoY to KRW 47.30 billion, reflecting an operating margin of approximately 47.4%, indicating robust pricing power and demand for its semiconductor test sockets and probe pins. Net income rose 37.7% YoY to KRW 40.40 billion. The double-digit sequential and YoY growth across all profit lines suggests accelerating demand from advanced semiconductor packaging and HBM-related testing, a positive read-through for the broader Korean semiconductor equipment supply chain. Figures are preliminary and unaudited under K-IFRS.